ZHCSCE8F April   2014  – May 2019

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      TPD1S514 系列电路保护方案
      2.      TPD1S514 系列方框图
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Consumption
    6. 7.6  Electrical Characteristics EN Pin
    7. 7.7  Thermal Shutdown Feature
    8. 7.8  Electrical Characteristics nFET Switch
    9. 7.9  Electrical Characteristics OVP Circuit
    10. 7.10 Electrical Characteristics VBUS_POWER Circuit
    11. 7.11 Timing Requirements
    12. 7.12 TPD1S514-1 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Over Voltage Protection on VBUS_CON up to 30 V DC
      2. 8.3.2  Precision OVP (< ±1% Tolerance)
      3. 8.3.3  Low RON nFET Switch Supports Host and Charging Mode
      4. 8.3.4  VBUS_POWER, TPD1S514-1, TPD1S514-2, TPD1S514-3
      5. 8.3.5  VBUS_POWER, TPD1S514
      6. 8.3.6  Powering the System When Battery is Discharged
      7. 8.3.7  ±15 kV IEC 61000-4-2 Level 4 ESD Protection
      8. 8.3.8  100 V IEC 61000-4-5 µs Surge Protection
      9. 8.3.9  Startup and OVP Recovery Delay
      10. 8.3.10 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation With VBUS_CON < 3.5 V (Minimum VBUS_CON)
      2. 8.4.2 Operation With VBUS_CON > VOVP
      3. 8.4.3 OTG Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TPD1S514-1 USB 2.0/3.0 Case 1: Always Enabled
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 VBUS Voltage Range
          2. 9.2.1.2.2 Discharged Battery
        3. 9.2.1.3 Application Curves
      2. 9.2.2 TPD1S514-1 USB 2.0/3.0 Case 2: PMIC Controlled EN
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 VBUS Voltage Range
          2. 9.2.2.2.2 PMIC Power Requirement
          3. 9.2.2.2.3 Discharged Battery
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 社区资源
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YZ|12
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.2 Layout Example

TPD1S514x layout_ex_slvscf6.gif
When designing layout for the TPD1S514 Family, note that VBUS_CON and VBUS_SYS pins allow extra wide traces for good power delivery. In the example shown, these pins are routed with 50 mil (1.27 mm) wide traces. Place the VBUS_CON, VBUS_SYS, and VBUS_POWER capacitors as close to the pins as possible. Use external and internal ground planes and stitch them together with VIAs as close to the GND pins of TPD1S514 as possible. This allows for a low impedance path to ground so that the device can properly dissipate any surge or ESD events.
Figure 15. Layout Recommendation