ZHCS404F September   2011  – October 2015 TPD12S016

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Conforms to HDMI Compliance Tests Without any External Components
      2. 7.3.2  IEC 61000-4-2 ESD Protection
      3. 7.3.3  Supports HDMI 1.4 Data Rate
      4. 7.3.4  Matches Class D and Class C Pin Mapping
      5. 7.3.5  8-Channel ESD Lines for Four Differential Pairs with Ultra-low Differential Capacitance Matching (0.05 pF)
      6. 7.3.6  On-Chip Load Switch With 55-mA Current Limit Feature at the HDMI 5V_OUT Pin
      7. 7.3.7  Auto-direction Sensing I2C Level Shifter With One-Shot Circuit to Drive a Long HDMI Cable (750-pF Load)
      8. 7.3.8  Back-Drive Protection on HDMI Connector Side Ports
      9. 7.3.9  Integrated Pullup and Pulldown Resistors per HDMI Specification
      10. 7.3.10 Space Saving 24-Pin RKT Package and 24-TSSOP Package
      11. 7.3.11 DDC/CEC LEVEL SHIFT Circuit Operation
      12. 7.3.12 DDC/CEC Level Shifter Operational Notes For VCCA = 1.8 V
      13. 7.3.13 Rise-Time Accelerators
      14. 7.3.14 Noise Considerations
      15. 7.3.15 Resistor Pullup Value Selection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Example 1: HDMI Controller Using One Control Line
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Example 2: HDMI Controller Using CT_HPD and LS_OE
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 TPD12S016RKT
      2. 10.2.2 TPD12S016PW
  11. 11器件和文档支持
    1. 11.1 社区资源
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 Glossary
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RKT|24
  • PW|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from E Revision (December 2014) to F Revision

  • Added test condition frequency to capacitance Go
  • Added test condition frequency to capacitance Go
  • 已添加 社区资源 Go

Changes from D Revision (August 2013) to E Revision

  • Added 处理额定值表，特性 描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go

Changes from * Revision (January 2013) to A Revision

  • Added Eye Diagram Using EVM Without TPD12S016 for the TMDS Lines at 1080p, 340MHz Pixel Clock, 3.4GbpsGo
  • Added Eye Diagram Using EVM with TPD12S016 for the TMDS Lines at 1080p, 340MHz Pixel Clock, 3.4GbpsGo

Changes from A Revision (February 2013) to B Revision

  • Added PW and RKT packages values for IO capacitanceGo
  • Added LOAD SWITCH ILEAKAGE_REVERSE vs V5V_OUT graph.Go
  • Updated Circuit Schematic Diagram.Go

Changes from B Revision (February 2013) to C Revision

  • Updated table formatting.Go

Changes from C Revision (August 2013) to D Revision

  • Updated power savings options table.Go