ZHCS891G April   2012  – December 2017 TPA3116D2 , TPA3118D2 , TPA3130D2

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化应用电路
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 AC Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Gain Setting and Master and Slave
      2. 7.3.2  Input Impedance
      3. 7.3.3  Startup and Shutdown Operation
      4. 7.3.4  PLIMIT Operation
      5. 7.3.5  GVDD Supply
      6. 7.3.6  BSPx AND BSNx Capacitors
      7. 7.3.7  Differential Inputs
      8. 7.3.8  Device Protection System
      9. 7.3.9  DC Detect Protection
      10. 7.3.10 Short-Circuit Protection and Automatic Recovery Feature
      11. 7.3.11 Thermal Protection
      12. 7.3.12 Device Modulation Scheme
        1. 7.3.12.1 MODSEL = GND: BD-Modulation
        2. 7.3.12.2 MODSEL = HIGH: 1SPW-modulation
      13. 7.3.13 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
      14. 7.3.14 Ferrite Bead Filter Considerations
      15. 7.3.15 When to Use an Output Filter for EMI Suppression
      16. 7.3.16 AM Avoidance EMI Reduction
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mono Mode (PBTL)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the PWM Frequency
        2. 8.2.2.2 Select the Amplifier Gain and Master/Slave Mode
        3. 8.2.2.3 Select Input Capacitance
        4. 8.2.2.4 Select Decoupling Capacitors
        5. 8.2.2.5 Select Bootstrap Capacitors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Heat Sink Used on the EVM
  11. 11器件和文档支持
    1. 11.1 相关链接
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 AC Electrical Characteristics

TA = 25°C, AVCC = PVCC = 12 V to 24 V, RL = 4 Ω (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
KSVR Power supply ripple rejection 200 mVPP ripple at 1 kHz, Gain = 20 dB, Inputs AC-coupled to GND –70 dB
PO Continuous output power THD+N = 10%, f = 1 kHz, PVCC = 14.4 V 25 W
THD+N = 10%, f = 1 kHz, PVCC = 21 V 50
THD+N Total harmonic distortion + noise VCC = 21 V, f = 1 kHz, PO = 25 W (half-power) 0.1%
Vn Output integrated noise 20 Hz to 22 kHz, A-weighted filter, Gain = 20 dB 65 µV
–80 dBV
Crosstalk VO = 1 Vrms, Gain = 20 dB, f = 1 kHz –100 dB
SNR Signal-to-noise ratio Maximum output at THD+N < 1%, f = 1 kHz, Gain = 20 dB, A-weighted 102 dB
fOSC Oscillator frequency AM2=0, AM1=0, AM0=0 376 400 424 kHz
AM2=0, AM1=0, AM0=1 470 500 530
AM2=0, AM1=1, AM0=0 564 600 636
AM2=0, AM1=1, AM0=1 940 1000 1060
AM2=1, AM1=0, AM0=0 1128 1200 1278
AM2=1, AM1=0, AM0=1 Reserved
AM2=1, AM1=1, AM0=0
AM2=1, AM1=1, AM0=1
Thermal trip point 150+ °C
Thermal hysteresis 15 °C
Over current trip point TPA3130D2 4.5 A
TPA3118D2, TPA3116D2 7.5