ZHCSNI4B July   2020  – December 2022 TMUX6234

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Source or Drain Continuous Current
    6. 6.6  36 V Single Supply: Electrical Characteristics 
    7. 6.7  36 V Single Supply: Switching Characteristics 
    8. 6.8  ±15 V Dual Supply: Electrical Characteristics 
    9. 6.9  ±15 V Dual Supply: Switching Characteristics 
    10. 6.10 12 V Single Supply: Electrical Characteristics 
    11. 6.11 12 V Single Supply: Switching Characteristics 
    12. 6.12 ±5 V Dual Supply: Electrical Characteristics 
    13. 6.13 ±5 V Dual Supply: Switching Characteristics 
    14. 6.14 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  Transition Time
    5. 7.5  tON(EN) and tOFF(EN)
    6. 7.6  Break-Before-Make
    7. 7.7  tON (VDD) Time
    8. 7.8  Propagation Delay
    9. 7.9  Charge Injection
    10. 7.10 Off Isolation
    11. 7.11 Crosstalk
    12. 7.12 Bandwidth
    13. 7.13 THD + Noise
    14. 7.14 Power Supply Rejection Ratio (PSRR)
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Rail-to-Rail Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Fail-Safe Logic
      5. 8.3.5 Latch-Up Immune
      6. 8.3.6 Ultra-Low Charge Injection
    4. 8.4 Device Functional Modes
    5. 8.5 Truth Tables
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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Detailed Design Procedure

The application shown in Figure 9-1 demonstrates how to toggle between the DAC output and a low signal voltage for control of a power amplifier. A device such as the TMUX6234 that supports multiple supply voltage combinations allows the system designer to use a single switch across platforms with different power amplifier topologies such as GaN or LDMOS implementations. Using a multi-channel switch like the TMUX6234 allows the system to improve density by implementing a smaller solution size. Multiple channels of the TMUX6234 can be utilized to switch additional stages of a single power amplifier channel. Or multiple channel switches can be used on different power amplifier stages in high channel count communicaitons equipment such as a 32 transmist (TX), 32 receive (RX) active antenna system mMIMIO (AAS). Each channel of the TMUX6234 has independent control signals allowing for overal system flexibility. The DAC output is utilized to bias the gate of the power amplifier and can be disconnected from the circuit using the select pins of the switch or the golbal enable pin. The TMUX6234 can support 1.8 V logic signals on the control input, allowing the device to interface with low logic controls of an FPGA or MCU. All inputs to the switch must fall within the recommend operating conditions of the TMUX6234 including signal range and continuous current. For this design with a positive supply of 8 V on VDD, and negative supply of -12 V on VSS, the signal range can be 8 V to -12 V. The maximum continuous current (IDC) is captured in the Recommended Operating Conditions table for a range of supply voltage cases.