SNIS238A July   2025  – July 2026 TMP9R01-SEP , TMP9R01-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Information
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing
    7. 6.7 Quality Conformance Inspection
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
      2. 7.3.2 Decoding Temperature Data
      3. 7.3.3 Series Resistance Cancellation
      4. 7.3.4 Differential Input Capacitance
      5. 7.3.5 Filtering
      6. 7.3.6 Sensor Fault
      7. 7.3.7 ALERT and THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 General-Call Reset
  9. 8 Register Map
    1. 8.1 Register Information
      1. 8.1.1  Pointer Register
      2. 8.1.2  Local and Remote Temperature Registers
      3. 8.1.3  Status Register
      4. 8.1.4  Configuration Register
      5. 8.1.5  Conversion Rate Register
      6. 8.1.6  One-Shot Start Register
      7. 8.1.7  Channel Enable Register
      8. 8.1.8  Consecutive ALERT Register
      9. 8.1.9  η-Factor Correction Register
      10. 8.1.10 Remote Temperature Offset Register
      11. 8.1.11 Manufacturer Identification Register
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Radiation Environments
      1. 9.3.1 Single Event Latch-Up
      2. 9.3.2 Single Event Functional Interrupt
      3. 9.3.3 Single Event Upset
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Related Documentation
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.2.3 Application Curve

Figure 9-3 shows the step response of the TMP9R01-SEP and TMP9R01-SP devices to a submersion in an oil bath of 100°C from room temperature (25°C). The time-constant, or the time for the output to reach 63% of the input step, is around 1.1s for local sensors and 0.6s for the remote diode sensor. The time-constant result depends on the printed-circuit board (PCB) size that the device is mounted. For this test, the device is soldered to a two-layer PCB that measures 0.5 inches × 0.5 inches.

TMP9R01-SEP TMP9R01-SP Temperature Step Response
Local: soldered devices on 62mil 2-layer FR4 PCB
Remote: characterized with 2N3906 PNP transistor
Figure 9-3 Temperature Step Response