ZHCSKB0 October   2019 TMP63

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      典型实施电路
      2.      典型电阻与环境温度间的关系
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Thermistor Biasing Circuits
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Thermal Protection With Comparator
          2. 8.2.1.2.2 Thermal Foldback
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Application Information

The TMP63 is a positive temperature coefficient (PTC) linear silicon thermistor. The device behaves like a temperature-dependent resistor, and may be configured in a variety of ways to monitor temperature based on the system-level requirements. The TMP63 has a nominal resistance at 25°C (R25) of 100 kΩ, a maximum operating voltage of 5.5 V (VSns), and maximum supply current of 400 µA (ISns). This device may be used in a variety of applications to monitor temperature close to a heat source with the very small DEC package option compatible with the typical 0402 (inch) footprint. Some of the factors that influence the total measurement error include the ADC resolution (if applicable), the tolerance of the bias current or voltage, the tolerance of the bias resistance in the case of a voltage divider configuration, and the location of the sensor with respect to the heat source.