ZHCSA58F June   2006  – May 2018 TMP275

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化电路原理图
      2.      内部框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
      3. 7.3.3 Bus Overview
      4. 7.3.4 Serial Bus Address
        1. 7.3.4.1 Writing and Reading to the TMP275
        2. 7.3.4.2 Slave Mode Operations
          1. 7.3.4.2.1 Slave Receiver Mode
          2. 7.3.4.2.2 Slave Transmitter Mode
        3. 7.3.4.3 SMBus Alert Function
        4. 7.3.4.4 General Call
        5. 7.3.4.5 High-Speed Mode
        6. 7.3.4.6 Time-Out Function
      5. 7.3.5 Timing Diagrams
      6. 7.3.6 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 Thermostat Mode (TM)
        1. 7.4.2.1 Comparator Mode (TM = 0)
        2. 7.4.2.2 Interrupt Mode (TM = 1)
      3. 7.4.3 One-Shot (OS)
    5. 7.5 Programming
      1. 7.5.1  Pointer Register
        1. 7.5.1.1 Pointer Register Byte (offset = N/A) [reset = 00h]
        2. 7.5.1.2 Pointer Addresses of the TMP275
          1. Table 3. Pointer Addresses of the TMP275 Field Description
      2. 7.5.2  Temperature Register
      3. 7.5.3  Configuration Register
      4. 7.5.4  Shutdown Mode (SD)
      5. 7.5.5  Thermostat Mode (TM)
      6. 7.5.6  Polarity (POL)
      7. 7.5.7  Fault Queue (F1/F0)
      8. 7.5.8  Converter Resolution (R1/R0)
      9. 7.5.9  One-Shot (OS)
      10. 7.5.10 High and Low Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Connections of the TMP275
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Connecting Multiple Devices on a Single Bus
      3. 8.2.3 Temperature Data Logger for Cold Chain Management Applications
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.2.3 Temperature Data Logger for Cold Chain Management Applications

Cold chain management includes all of the means used to ensure a constant temperature for a product that is not heat stable from the time it is manufactured or farmed until the time it is used. This includes industries such as food, retail, medical, and pharmaceutical. Figure 19 implements a cold chain monitoring system that measures temperature, then logs the sensor data to nonvolatile (FRAM) memory in the MCU. Figure 19 uses a Near Field Communication (NFC) interface for wireless communication and is powered from a CR2032 coin cell battery with a focus on low power to maximize the battery lifetime.

The microcontroller communicates with all of the sensor devices through an I2C-compatible interface. The MCU also communicates with the NFC transponder through this interface. An NFC enabled smartphone can be used to send configuration to the application board. For a detailed design procedure and requirements of this application, see Ultralow Power Multi-Sensor Data Logger with NFC Interface Reference Design (TIDU821).

TMP275 appdiagram_tmp275.gifFigure 19. Temperature Data Logger