4 Revision History
Changes from Revision D (October 2019) to Revision E (August 2021)
- 向列表中添加了 TMP1075N 特性Go
- 向特性列表添加了典型精度规格Go
- 添加了 SOT563(TMP1075N 可订购)封装Go
- 在“说明(续)”部分中添加了 TMP1075N 温度范围Go
- Added Device Comparison SectionGo
- Added figures for different package optionsGo
- Added column for TMP1075N pin numbersGo
- Added TMP1075N SpecificationsGo
- Added TMP1075NDRL Temperature Error vs. Temperature graph Go
- Added TMP1075N information in Overview SectionGo
- Changed the Functional Block Diagram to apply to
TMP1075NGo
- Added number of I2C addresses available on TMP1075N to Serial Bus Address Section. Go
- Added table for TMP1075N address options. Go
- Updated internal register structure figure to apply to TMP1075NGo
- Added typical specification for TMP1075N timeout Go
- Added clarification on timeout function to include
SCLGo
- Removed redundant information to accurate describe all
packagesGo
- Added TMP1075N OS bit behaviorGo
- Added TMP1075N Continuous Conversion Mode informationGo
- Updated Conversion Rate Diagram to reflect all TMP1075 and TMP1075NGo
- Clarified what TM bit behavior for TMP1075 and TMP1075N Go
- Added table note to indicate Device ID register is not available on TMP1075NGo
- Added TMP1075N configuration register information Go
- Updated text to indicate that device ID register does not apply to
TMP1075NGo
- Added number of I2C addresses available on TMP1075NGo
- Changed Typical Connections figure to apply to TMP1075NGo
- Removed redundant Application Curve sectionGo
- Updated text to
include TMP1075N informationGo
- Updated Migrating From the xx75 Device Family section to specify
TMP1075 compatible packages Go
- Included TMP1075N information to Power Supply
RecommendationsGo
- Added figures to the Layout Example section for each
packageGo
Changes from Revision C (January 2019) to Revision D (October 2019)
- 向特性列表中添加了软件兼容性Go
- Updated absolute max for Power supply V+ to 6.5V from 6VGo
- Updated absolute max for Input voltage on SCL, SDA, A1, A0 to 6.5V from 6VGo
- Updated pointer register to be part of the serial interface descriptionGo
- Updated the register map table to new formatGo
- Added access type codes for register bitsGo
- Updated temperature register format and bit definition tableGo
- Updated configuration register format and bit definition table Go
- Updated low limit register format
and bit definition table Go
- Updated high limit register format and bit definition table Go
- Updated device ID register format and bit definition table Go
Changes from Revision B (December 2018) to Revision C (January 2019)
- 将 TMP1075DSG 封装从“预发布”更改为“量产数据”Go
- 将温度精度 (DGK & D) 图表的最小/最大数值由 1.5°C 更改为 1°CGo
- Changed min/max limit from 1.5°C to 1°C in the DGK & D Temperature Error vs. Temperature graphGo
- Added DSG Temperature Error vs. Temperature graph Go
Changes from Revision A (June 2018) to Revision B (December 2018)
- 增加了 TMP1075DSG 封装Go
- 更新了数据表的说明部分并添加了说明(续)部分Go
- Added TMP1075 configuration register support for single byte read and
writeGo
- Added Software support section for migrating from xx75 to TMP1075 Go
Changes from Revision * (March 2018) to Revision A (June 2018)
- 将 TMP1075DGK 可订购状态从“预告信息”更改为“量产数据”Go
- 添加了 SOIC 和 DFN 封装Go
- Changed the Functional Block Diagram
Go
- Changed Digital Temperature Output crossreference from: Temperature Register (0x00) to: Temperature Data Format
Go
- Changed the Temperature Data Format table Go
- Changed and renamed the Address Pins and Slave Addresses for the TMP1075 table to Address Pins State
Go
- Changed the Two-Wire Timing Diagrams section Go
- Added content to the Device Functional Modes section Go