SBOS545D February   2011  – December 2018 TMP103

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 One-Shot Mode
      3. 7.4.3 Continuous Conversion Mode
    5. 7.5 Programming
      1. 7.5.1  Temperature Watchdog Function
      2. 7.5.2  Conversion Rate
      3. 7.5.3  Shutdown Mode (M1 = 0, M0 = 0)
      4. 7.5.4  One-Shot (M1 = 0, M0 = 1)
      5. 7.5.5  Continuous Conversion Mode (M1 = 1)
      6. 7.5.6  Bus Overview
      7. 7.5.7  Serial Interface
      8. 7.5.8  Serial Bus Address
      9. 7.5.9  Writing and Reading Operation
      10. 7.5.10 Slave Mode Operations
        1. 7.5.10.1 Slave Receiver Mode
        2. 7.5.10.2 Slave Transmitter Mode
      11. 7.5.11 General Call
      12. 7.5.12 High-Speed (Hs) Mode
      13. 7.5.13 Timeout Function
      14. 7.5.14 Multiple Device Access
        1. 7.5.14.1 Multiple Device Access Write
        2. 7.5.14.2 Multiple Device Access Read
      15. 7.5.15 NOISE
    6. 7.6 Register Maps
      1. 7.6.1 Pointer Register
      2. 7.6.2 Temperature Register
      3. 7.6.3 Configuration Register
      4. 7.6.4 Temperature Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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订购信息

8.2.2 Detailed Design Procedure

The TMP103 devices must be placed in close proximity to the heat source that must be monitored, with a proper layout for good thermal coupling. This placement ensures that temperature changes are captured within the shortest possible time interval. To maintain accuracy in applications that require air or surface temperature measurement, take care to isolate the package and leads from ambient air temperature. The TMP103 device is a very low-power device and generates very low noise on the supply bus. Applying an RC filter to the V+ pin of the TMP103 device can further reduce any noise that the TMP103 device might propagate to other components.