ZHCSPN7A March   2023  – February 2024 TMAG6181-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Magnetic Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Magnetic Flux Direction
      2. 6.3.2 Sensors Location and Placement Tolerances
      3. 6.3.3 Magnetic Response
      4. 6.3.4 Parameters Definition
        1. 6.3.4.1 AMR Output Parameters
        2. 6.3.4.2 Transient Parameters
          1. 6.3.4.2.1 Power-On Time
        3. 6.3.4.3 Hall Sensor Parameters
        4. 6.3.4.4 Angle Accuracy Parameters
      5. 6.3.5 Automatic Gain Control (AGC)
      6. 6.3.6 Turns Counter
        1. 6.3.6.1 Rotation Tracking
      7. 6.3.7 Safety and Diagnostics
        1. 6.3.7.1 Device Level Checks
        2. 6.3.7.2 System Level Checks
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operating Modes
        1. 6.4.1.1 Active Mode
        2. 6.4.1.2 Active-Turns Mode
        3. 6.4.1.3 Low-Power Mode
        4. 6.4.1.4 Sleep Mode
        5. 6.4.1.5 Fault Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Power Supply as the Reference for External ADC
      2. 7.1.2 AMR Output Dependence on Airgap Distance
      3. 7.1.3 Calibration of Sensor Errors
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Designing with Multiple Sensors
          1. 7.2.2.1.1 Designing for Redundancy
          2. 7.2.2.1.2 Multiplexing Multiple Sensors
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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6.4.1.4 Sleep Mode

Sleep mode can place the device in the lowest current consumption state. When the voltage on SLEEP pin goes below VIL and stays low for longer than tsleep_mode, then the part enters sleep mode. The average current consumption during this mode is denoted by ISLEEP, and this mode uses approximately ten times less current compared to low-power mode. The part exits sleep mode when the voltage on the SLEEP pin goes above VIH.

There is a 500kΩ pulldown resistor on the SLEEP pin and, when the SLEEP pin left floating, the part enters the sleep mode. TI recommends to ensure the SLEEP pin is driven externally to a known logic state.