ZHCSBE7D August   2013  – July 2019 TLV702-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Undervoltage Lockout
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Transient Response
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Dissipation
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermal Consideration
      2. 10.1.2 Package Mounting
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 Spice 模型
      2. 11.1.2 器件命名规则
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from C Revision (January 2018) to D Revision

  • Changed OUT pin number from 5 to 3 in DSE column of Pin Functions table Go
  • Added footnote to maximum EN voltage specification Go
  • Added parameter names to Recommended Operating Conditions tableGo

Changes from B Revision (June 2015) to C Revision

  • Added 向文档添加了 DBV 封装Go
  • Changed 更改了封装 特性 项目符号以将 DBV 封装包括在内Go
  • Added DBV package to Pin Configuration and Functions sectionGo
  • Added DBV column to Thermal Information tableGo
  • Changed title of Layout Example for the DDC and DBV Packages figure to include DBV packageGo

Changes from A Revision (August 2013) to B Revision

  • 向数据表添加了 DSE（6 引脚 WSON）封装Go
  • 向数据表添加了器件信息、ESD 额定值 和建议运行条件 表，以及详细 说明、应用和实施、电源建议、布局、器件和文档支持，以及机械、封装和可订购信息 部分Go
  • Go
  • 在精度为 2% 中添加了“在工作温度范围内”特性项目符号中将“可编程”改为“可调节”Go
  • 在整篇数据表中将 DDC 封装名称从 TSOT23 更改为 SOTGo
  • 已更改应用 要点的措辞Go
  • 更改了说明 部分的文本Go
  • 将典型应用电路 上的陶瓷电容单位从 mF 更改成了 µF（拼写错误）Go
  • Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statementGo
  • Added TJ to TA condition in Electrical Characteristics condition statementGo
  • Changed TA to TJ for typical values in Electrcial Characteristics condition statementGo