SLOS157C June   1996  – May 2026 TLV2221

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Available Options
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Ratings Table for Old Device
    3. 5.3 Thermal Information for New device
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics: VDD = 3V
    6. 5.6 Operating Characteristics: VDD = 3V
    7. 5.7 Electrical Characteristics: VDD = 5V
    8. 5.8 Operating Characteristics: VDD = 5V
    9. 5.9 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Common-Mode Voltage Range
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 Description

The TLV2221 is a single low-voltage operational amplifier available in the SOT-23 package. TLV2221 offers a compromise between the ac performance and output drive of the TLV2231 and the micro-power TLV2211.

TLV2221 consumes only 150μA (max) of supply current and is designed for battery-powered applications. The device exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications.

The TLV2221, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers. Because of the micro-power dissipation levels combined with 3V operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs).

With a total area of 5.6mm2, the SOT-23 package only requires one-third the board space of the standard 8-pin SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal source, minimizing noise pick-up from long printed circuit board (PCB) traces. TI has also taken special care to provide a pinout that is optimized for board layout (see Typical Surface-Mount Layout for a Fixed-Gain Non-inverting Amplifier). Both inputs are separated by GND to prevent coupling or leakage paths. The OUT and IN− terminals are on the same end of the board to provide negative feedback. Finally, gain setting resistors and decoupling capacitor are easily placed around the package.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
TLV2221 DBV (SOT-23, 5) 2.90mm × 1.60mm
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
TLV2221 Symbol (Each Amplifier)Symbol (Each Amplifier)
TLV2221 Typical Surface-Mount Layout for a Fixed-Gain Non-inverting AmplifierTypical Surface-Mount Layout for a Fixed-Gain Non-inverting Amplifier