SLOS157C June   1996  – May 2026 TLV2221

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Available Options
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Ratings Table for Old Device
    3. 5.3 Thermal Information for New device
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics: VDD = 3V
    6. 5.6 Operating Characteristics: VDD = 3V
    7. 5.7 Electrical Characteristics: VDD = 5V
    8. 5.8 Operating Characteristics: VDD = 5V
    9. 5.9 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Common-Mode Voltage Range
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Thermal Information for New device

THERMAL METRIC (1) DBV
(SOT-23)		 UNIT
5 PINS
RθJA Junction-to-ambient thermal resistance 192.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 113.6 °C/W
RθJB Junction-to-board thermal resistance 60.5 °C/W
ψJT Junction-to-top characterization parameter 37.2 °C/W
ψJB Junction-to-board characterization parameter 60.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.