ZHCSIC6A June   2018  – January 2019 TLC6946 , TLC6948

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      T48 路多路复用 LC6948典型应用原理图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Pin Equivalent Input and Output Schematic Diagrams
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Built-In 16Kb Display Memory (SRAM)
      2. 9.3.2  GCLK Dual-Edge Operation
      3. 9.3.3  Programmable Constant-Sink Channel Current
        1. 9.3.3.1 Global Brightness Control (BC)
        2. 9.3.3.2 Select RIREF for a Given BC
      4. 9.3.4  Grayscale (GS) Function (PWM Control)
      5. 9.3.5  Serial Data Interface
      6. 9.3.6  LED-Open Detection (LOD)
      7. 9.3.7  Caterpillar Removal
      8. 9.3.8  Precharge FET
      9. 9.3.9  Thermal Shutdown
      10. 9.3.10 IREF Resistor Short Protection (ISP)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Operating Mode
      2. 9.4.2 Power-Save Mode (PSM)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 Power Supply Voltage
        2. 10.2.2.2 Channel Current and Brightness Control
        3. 10.2.2.3 SCLK and GCLK Frequency
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 相关链接
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage Supply voltage 3 5.5 V
VOUTn Voltage applied to OUT0 to OUT15 Voltage applied to OUT0 to OUT15 0 VCC V
VIH High-level input voltage GCLK, LAT, SCLK, SIN 0.7 × VCC VCC V
VIL Low-level input voltage GCLK, LAT, SCLK, SIN 0 0.3 × VCC V
IOH High-level output current SOUT –2 mA
IOL Low-level output current SOUT 2 mA
IOLC, max Maximum constant-output sink current OUT0 to OUT15 0.3 25 mA
fSCLK Data-shift clock frequency SCLK 33 MHz
fGCLK Grayscale control clock frequency GCLK 33 MHz
fGCLK,B Grayscale control clock frequency for dual-edge operation GCLK 25 MHz
tw(H0) Pulse width duration SCLK 10 ns
tw(L0) Pulse width duration SCLK 10 ns
tw(H1) Pulse width duration GCLK 10 ns
tw(L1) Pulse width duration GCLK 10 ns
tw(H2) Pulse width duration GCLK (for dual-edge operation) 18 ns
tw(L2) Pulse width duration GCLK (for dual-edge operation) 18 ns
tsu(0) Setup time SIN to SCLK↑ 2 ns
tsu(1) Setup time LAT ↑ to SCLK ↑ 5 ns
tsu(2) Setup time LAT ↓ to SCLK ↑ 5 ns
tsu(3) Setup time LAT ↓ to SCLK ↑ ,read data from SOUT 50 ns
tsu(4) Setup time LAT ↓ (WRTGS) to LAT ↓ (WRTGS) 1.5 µs
tsu(5) Setup time LAT ↓ (WRTGS) to LAT ↓ (VSYNC) 1.5 µs
tsu(6) Setup time LAT ↓ (VSYNC) to GCLK ↑ 2.5 µs
tsu(7) Setup time LAT ↓ (VSYNC) to LAT ↓ (WRTGS) 2.5 µs
tsu(8) Setup time Last LAT (non-0 GS data latched) ↓ to the first GCLK ↑ of next frame (wake up from power-save mode) 50 µs
tLSW Line switching time Last GCLK ↓ to the first GCLK ↑ of next line 1 µs
th(0) Hold time SCLK ↑ to SIN 2 ns
th(1) Hold time SCLK ↑ to LAT ↑ 2 ns
th(2) Hold time SCLK ↑ to LAT ↓ 10 ns
TA Operating ambient temperature Operating ambient temperature –40 85 °C
TJ Operating junction temperature Operating junction temperature –40 125 °C