ZHCSI82E May   2018  – May 2019 THVD1410 , THVD1450 , THVD1451 , THVD1452

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      THVD1410 和 THVD1450 简化原理图
      2.      THVD1451 简化原理图
      3.      THVD1452 简化原理图
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
    3.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings [IEC]
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Power Dissipation
    7. 7.7  Electrical Characteristics
    8. 7.8  Switching Characteristics
    9. 7.9  Typical Characteristics: All Devices
    10. 7.10 Typical Characteristics: THD1450, THVD1451 and THVD1452
    11. 7.11 Typical Characteristics: THVD1410
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Functional Modes for THVD1410 and THVD1450
      2. 9.4.2 Device Functional Modes for THVD1451
      3. 9.4.3 Device Functional Modes for THVD1452
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Data Rate and Bus Length
        2. 10.2.1.2 Stub Length
        3. 10.2.1.3 Bus Loading
        4. 10.2.1.4 Receiver Failsafe
        5. 10.2.1.5 Transient Protection
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
    2. 13.2 第三方产品免责声明
    3. 13.3 相关链接
    4. 13.4 接收文档更新通知
    5. 13.5 社区资源
    6. 13.6 商标
    7. 13.7 静电放电警告
    8. 13.8 Glossary
  14. 14机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • DGK|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.7 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted). All typical values are at 25°C and supply voltage of VCC = 5 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver
|VOD| Driver differential output voltage magnitude RL = 60 Ω, -15 V ≤ Vtest ≤ 15 V (See Figure 20)(2) 1.5 3.5 V
RL = 60 Ω, -15 V ≤ Vtest ≤ 15 V, 4.5 V ≤ VCC ≤ 5.5 V, (See Figure 20) 2.1 V
RL = 100 Ω (See Figure 21) 2 4 V
RL = 54 Ω (See Figure 21) 1.5 3.5 V
Δ|VOD| Change in differential output voltage RL = 54 Ω (See Figure 21) -200 200 mV
VOC Common-mode output voltage 1 VCC/2 3 V
ΔVOC(SS) Change in steady-state common-mode output voltage -200 200 mV
IOS Short-circuit output current DE = VCC, -7 V ≤ VO ≤ 12 V -250 250 mA
Receiver
II Bus input current DE = 0 V, VCC = 0 V or 5.5 V VI = 12V 50 125 µA
VI = -7V -100 -65 µA
DE = 0 V, VCC = 0 V or 5.5 V VI = 15V 60 125 µA
VI = -15V -200 -130 µA
VTH+ Positive-going input threshold voltage Over common-mode range of ± 15 V See(1) -100 -20 mV
VTH- Negative-going input threshold voltage -200 -130 See(1) mV
VHYS Input hysteresis 30 mV
VOH Output high voltage IOH = -8 mA VCC – 0.4 VCC – 0.2 V
VOL Output low voltage IOL = 8 mA 0.2 0.4 V
IOZR Output high-impedance current VO = 0 V or VCC, RE = VCC -1 1 µA
Logic
IIN Input current (D, DE, RE) 3 V ≤ VCC ≤ 5.5 V, 0 V ≤ VIN ≤ VCC -6.2 6.2 µA
Device
ICC Supply current (quiescent) Driver and receiver enabled RE = 0 V , DE = VCC, No load 2.4 3 mA
Driver enabled, receiver disabled RE = VCC, DE = VCC, No load 2 2.5 mA
Driver disabled, receiver enabled RE = 0 V, DE = 0 V, No load 700 960 µA
Driver and receiver disabled RE = VCC, DE = 0 V, D = open, No load 0.1 1 µA
TSD Thermal shutdown temperature 170 ℃
(1) Under any specific conditions, VTH+ is assured to be at least VHYS higher than VTH–.
(2) |VOD| ≥ 1.4 V when TA > 85 ℃, Vtest < -7 V and VCC < 3.135 V.