ZHCSAT1D December   2012  – July 2017 TCA9517

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化的原理图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 I2C Interface Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Two-Channel Bidirectional Buffer
      2. 9.3.2 Active-High Repeater-Enable Input
      3. 9.3.3 VOL B-Side Offset Voltage
      4. 9.3.4 Standard Mode and Fast Mode Support
      5. 9.3.5 Clock Stretching Support
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Clock Stretching Support
        2. 10.2.2.2 VILC and Pullup Resistor Sizing
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 社区资源
    2. 13.2 商标
    3. 13.3 静电放电警告
    4. 13.4 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)TCA9517UNIT
DGK (VSSOP)D (SOIC)
8 PINS8 PINS
RθJA Junction-to-ambient thermal resistance 187.6 133.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.3 87.6 °C/W
RθJB Junction-to-board thermal resistance 108.6 74.2 °C/W
ψJT Junction-to-top characterization parameter 3.4 36.9 °C/W
ψJB Junction-to-board characterization parameter 106.9 73.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.