ZHCS034C January   2011  – August 2018 TCA4311A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rise-Time Accelerators
      2. 8.3.2 READY Digital Output
      3. 8.3.3 EN Low Current Disable
    4. 8.4 Device Functional Modes
      1. 8.4.1 Start-Up
      2. 8.4.2 Connection Circuitry
      3. 8.4.3 Missing ACK Event
        1. 8.4.3.1 System Impact
        2. 8.4.3.2 System Workaround
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Input to Output Offset Voltage
        2. 9.2.1.2 Propagation Delays
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Resistor Pull-Up Value Selection
      3. 9.2.3 Application Curves
      4. 9.2.4 Live Insertion and Capacitance Buffering CompactPCI Application
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
      5. 9.2.5 Live Insertion and Capacitance Buffering PCI Application
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
        3. 9.2.5.3 Application Curves
      6. 9.2.6 Repeater/Bus Extender Application
        1. 9.2.6.1 Design Requirements
        2. 9.2.6.2 Detailed Design Procedure
        3. 9.2.6.3 Application Curves
      7. 9.2.7 Systems With Disparate Supply Voltages
        1. 9.2.7.1 Design Requirements
        2. 9.2.7.2 Detailed Design Procedure
        3. 9.2.7.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

D OR DGK Packages
(Top View)

Pin Functions

PIN DESCRIPTION
NAME NUMBER
EN 1 Active-high chip enable pin. If EN is low, the TCA4311A is in a low current (<1 μA) mode. It also disables the rise-time accelerators, disables the bus pre-charge circuitry, drives READY low, isolates SDAIN from SDAOUT and isolates SCLIN from SCLOUT. EN should be high (at VCC) for normal operation. Connect EN to VCC if this feature is not being used.
SCLOUT 2 Serial clock output. Connect this pin to the SCL bus on the card.
SCLIN 3

Serial clock input. Connect this pin to the SCL bus on the backplane.
GND 4 Supply ground
READY 5 Connection flag/rise-time accelerator control. READY is low when either EN is low or the start-up sequence described in the operation section has not been completed. READY goes high when EN is high and start-up is complete. Connect a 10-kΩ resistor from this pin to VCC to provide the pull up.
SDAIN 6 Serial data input. Connect this pin to the SDA bus on the backplane.
SDAOUT 7 Serial data output. Connect this pin to the SDA bus on the card.
VCC 8 Supply power. Main input power supply from backplane. This is the supply voltage for the devices on the backplane I2C busses. Connect pull-up resistors from SDAIN and SCLIN (and also from SDAOUT and SCLOUT) to this pin. Place a bypass capacitor of at least 0.01 μF close to this pin for best results.