ZHCS930A May   2012  – March 2015 TAS5614LA

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Audio Specification Stereo (BTL)
    7. 6.7 Audio Specification 4 Channels (SE)
    8. 6.8 Audio Specification Mono (PBTL)
    9. 6.9 Typical Characteristics
      1. 6.9.1 BTL Configuration
      2. 6.9.2 SE Configuration
      3. 6.9.3 PBTL Configuration
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1  Power Supplies
        1. 7.3.1.1 Boot Strap Supply
      2. 7.3.2  System Power-Up and Power-Down Sequence
        1. 7.3.2.1 Powering Up
        2. 7.3.2.2 Powering Down
      3. 7.3.3  Start-up and Shutdown Ramp Sequence
      4. 7.3.4  Unused Output Channels
      5. 7.3.5  Device Protection System
      6. 7.3.6  Pin-to-Pin Short-Circuit Protection (PPSC)
      7. 7.3.7  Overtemperature Protection
      8. 7.3.8  Overtemperature Warning, OTW
      9. 7.3.9  Undervoltage Protection (UVP) and Power-On Reset (POR)
      10. 7.3.10 Error Reporting
      11. 7.3.11 Fault Handling
      12. 7.3.12 Device Reset
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mode Selection Pins
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 System Design Consideration
    2. 8.2 Typical Applications
      1. 8.2.1 Typical BTL Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical SE Configuration
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Typical PBTL Configuration
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material Recommendation
      2. 10.1.2 PVDD Capacitor Recommendation
      3. 10.1.3 Decoupling Capacitor Recommendation
      4. 10.1.4 Circuit Component and Printed Circuit Board Recommendation
        1. 10.1.4.1 Circuit Component Requirements
        2. 10.1.4.2 Printed Circuit Board Requirements
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from * Revision (May 2012) to A Revision

  • Added 引脚配置和功能部分，ESD 额定值表，特性描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go