ZHCSTI3E June   1986  – October 2023 SN75ALS193

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Rating
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • N|16
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1)SN75ALS193UNIT
N (PDIP)D (SOIC)
16 Pins 16 Pins
R θJAJunction-to-ambient thermal resistance60.684.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance48.143.5°C/W
R θJBJunction-to-board thermal resistance40.643.2°C/W
ψ JTJunction-to-top characterization parameter27.510.4°C/W
ψ JBJunction-to-board characterization parameter40.342.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.