SCAS297O January   1993  – June 2026 SN74LVC540A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   5
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, SN74LVC540A
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  8. 6 Parameter Measurement Information
    1. 6.1 17
  9.   18
  10. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 Partial Power Down (Ioff)
      3. 7.3.3 Standard CMOS Inputs
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  11. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  12. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  13. 10Revision History
  14. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGV|20
  • DB|20
  • NS|20
  • DW|20
  • PW|20
  • DGS|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4.1 Layout Guidelines

  • Bypass capacitor placement
    • Place near the positive supply terminal of the device
    • Provide an electrically short ground return path
    • Use wide traces to minimize impedance
    • Keep the device, capacitors, and traces on the same side of the board whenever possible
  • Signal trace geometry
    • 8mil to 12mil trace width
    • Lengths less than 12cm to minimize transmission line effects
    • Avoid 90° corners for signal traces
    • Use an unbroken ground plane below signal traces
    • Flood fill areas around signal traces with ground
    • Parallel traces must be separated by at least 3x dielectric thickness
    • For traces longer than 12cm
      • Use impedance controlled traces
      • Source-terminate using a series damping resistor near the output
      • Avoid branches; buffer each signal that must branch separately