ZHCSR29M December   2003  – October 2022 SN74LVC2T45

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    7. 6.7  Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    8. 6.8  Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    9. 6.9  Switching Characteristics: VCCA = 5 V ± 0.5 V
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.65-V to 5.5-V Power-Supply Range
      2. 8.3.2 Support High-Speed Translation
      3. 8.3.3 Ioff Supports Partial-Power-Down Mode Operation
      4. 8.3.4 Balanced High-Drive CMOS Push-Pull Outputs
      5. 8.3.5 Vcc Isolation
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Unidirectional Logic Level-Shifting Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Bidirectional Logic Level-Shifting Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Enable Times
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power-Up Considerations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision L (October 2022) to Revision M (October 2022)

  • Changed the TA operating free-air temperature back to 85°C Go

Changes from Revision K (June 2017) to Revision L (October 2022)

  • Updated the thermals in the Thermal Information sectionGo
  • Extended the minimum specifications for lower delays in the Switching Characteristics sectionsGo

Changes from Revision J (October 2014) to Revision K (June 2017)

  • 更改了数据表标题Go
  • Added Junction temperature, TJ in Absolute Maximum Ratings Go

Changes from Revision I (March 2007) to Revision J (October 2014)

  • 添加了引脚配置和功能 部分、ESD 等级 表、特性说明 部分、器件功能模式应用和实现 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go