ZHCSM00N
April 1999 – September 2020
SN74LVC2G126
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Switching Characteristics, –40°C to +85°C
6.7
Switching Characteristics, –40°C to +125°C
6.8
Operating Characteristics
6.9
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curve
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Receiving Notification of Documentation Updates
12.2
Support Resources
12.3
Trademarks
12.4
Electrostatic Discharge Caution
12.5
Glossary
13
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
DCU|8
YZP|8
DCT|8
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsm00n_oa
zhcsm00n_pm
6.4
Thermal Information
THERMAL METRIC
(1)
SN74LVC2G126
UNIT
DCT (SM8)
DCU (VSSOP)
YZP (DSBGA)
8 PINS
R
θJA
Junction-to-ambient thermal resistance
220
227
102
°C/W
(1)
For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics
application report.