ZHCSNG7D August 2020 – December 2021 SN74HCS165-Q1
PRODUCTION DATA
THERMAL METRIC(1) | SN74HCS165-Q1 | UNIT | |||||
---|---|---|---|---|---|---|---|
PW (TSSOP) | D (SOIC) | BQB (WQFN) | DYY (SOT) | WBQB (WQFN) | |||
16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 141.2 | 122.2 | 108.4 | 186.2 | 97.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 78.8 | 80.9 | 77.3 | 109.1 | 93.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 85.8 | 80.6 | 74.4 | 111.0 | 66.4 | °C/W |
ΨJT | Junction-to-top characterization parameter | 27.7 | 40.4 | 12.6 | 18.0 | 14.6 | °C/W |
ΨJB | Junction-to-board characterization parameter | 85.5 | 80.3 | 74.5 | 110.9 | 66.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | 54.3 | N/A | 44.3 | °C/W |