ZHCSNG7D August   2020  – December 2021 SN74HCS165-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     4
    2.     5
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
      4. 8.3.4 Latching Logic
      5. 8.3.5 Wettable Flanks
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (June 2021) to Revision D (December 2021)

  • 向器件信息 表添加了 WBQB 封装信息Go
  • Added WBQB Package pinout diagram and information to Pin Configuration and Functions.Go
  • Added WBQB package to Thermal Information tableGo
  • Added wettable flanks to Feature Description Go

Changes from Revision B (March 2021) to Revision C (June 2021)

  • 将 DYY 封装从“产品预发布”更改为“量产数据”Go

Changes from Revision A (February 2021) to Revision B (March 2021)

  • Added DYY Package pinout diagram and information to Pin Configuration and Functions.Go
  • Added DYY Package to Thermal Information tableGo

Changes from Revision * (August 2020) to Revision A (February 2021)

  • 向器件信息 表添加了 BQB 封装信息Go
  • Added BQB package information to Pin Configuration and Functions Go
  • Added BQB package information to the Thermal Information tableGo