ZHCSQI9I December 2003 – March 2024 SN74AVC1T45
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
THERMAL METRIC(1) | SN74AVC1T45 | UNIT | |||||
---|---|---|---|---|---|---|---|
DBV | DCK | DRL | YZP | ||||
6 PINS | |||||||
RθJA | Junction-to-ambient thermal resistance | 183.4 | 211.4 | 236.2 | 130 | °C/W | |
RθJC(top) | Junction-to-case (top) thermal resistance | 102.5 | 145.2 | 135.2 | 54 | ||
RθJB | Junction-to-board thermal resistance | 92.6 | 65.7 | 111.7 | 51 | ||
ψJT | Junction-to-top characterization parameter | 39.5 | 47.0 | 16.5 | 1 | ||
ψJB | Junction-to-board characterization parameter | 63.4 | 65.4 | 111.0 | 50 | ||
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A |