ZHCSV56A December   2009  – March 2024 SN65MLVD048

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Package Dissipation Ratings
    5. 5.5 Thermal Information
    6. 5.6 Device Electrical Characteristics
    7. 5.7 Receiver Electrical Characteristics
    8. 5.8 Receiver Switching Characteristics
    9. 5.9 Typical Characteristics
      1. 5.9.1 Eye Patterns
  7. 6 Parameter Measurement Information
  8. 7 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.5 Thermal Information

THERMAL METRIC(1) RGZ UNIT
48-Pins
R θJA Junction-to-ambient thermal resistance 25.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.1 °C/W
R θJB Junction-to-board thermal resistance 8.7 °C/W
ψ JT Junction-to-top characterization parameter 0.2 °C/W
ψ JB Junction-to-board characterization parameter 8.7 °C/W
R θJC(bot) Junction-to-case (bottom) thermal resistance 1.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.