SLLS575A AUGUST   2003  – July 2015 SN65LVDS049

PRODUCTION DATA.  

1. 1 Features
2. 2 Applications
3. 3 Description
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Device Electrical Characteristics
   6. 6.6 Switching Characteristics
   7. 6.7 Dissipation Rating
   8. 6.8 Typical Characteristics
7. 7 Parameter Measurement Information
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Driver Offset
      2. 8.3.2 Receiver Open Circuit Fail-Safe
      3. 8.3.3 Receiver Common-Mode Range
   4. 8.4 Device Functional Modes
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Applications
      1. 9.2.1 Point-to-Point Communications
         1. 9.2.1.1 Design Requirements
         2. 9.2.1.2 Detailed Design Procedure
            1. 9.2.1.2.1  Bypass Capacitance
            2. 9.2.1.2.2  Driver Supply Voltage
            3. 9.2.1.2.3  Driver Input Voltage
            4. 9.2.1.2.4  Driver Output Voltage
            5. 9.2.1.2.5  Interconnecting Media
            6. 9.2.1.2.6  PCB Transmission Lines
            7. 9.2.1.2.7  Termination Resistor
            8. 9.2.1.2.8  Receiver Supply Voltage
            9. 9.2.1.2.9  Receiver Input Common-Mode Range
            10. 9.2.1.2.10 Receiver Input Signal
            11. 9.2.1.2.11 Receiver Output Signal
         3. 9.2.1.3 Application Curve
      2. 9.2.2 Multidrop Communications
         1. 9.2.2.1 Design Requirements
         2. 9.2.2.2 Detailed Design Procedure
            1. 9.2.2.2.1 Interconnecting Media
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
       1. 11.1.1 Microstrip vs. Stripline Topologies
       2. 11.1.2 Dielectric Type and Board Construction
       3. 11.1.3 Recommended Stack Layout
       4. 11.1.4 Separation Between Traces
       5. 11.1.5 Crosstalk and Ground Bounce Minimization
       6. 11.1.6 Decoupling
    2. 11.2 Layout Example
12. 12Device and Documentation Support
    1. 12.1 Device Support
       1. 12.1.1 Development Support
    2. 12.2 Documentation Support
       1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
13. 13Mechanical, Packaging, and Orderable Information