ZHCSRD1G May   2000  – February 2023 SN65LBC176A , SN75LBC176A

PRODUCTION DATA  

  1. 1特性
  2. 2说明
  3. 3Revision History
  4. 4Pin Configuration and Functions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Driver Electrical Characteristics
    6. 5.6 Driver Switching Characteristics
    7. 5.7 Receiver Electrical Characteristics
    8. 5.8 Receiver Switching Characteristics
    9.     Typical Characteristics
      1.      参数测量信息
  6. 6Detailed Description
    1. 6.1 Device Functional Modes
      1. 6.1.1 Function Tables
      2. 6.1.2 Schematics
  7. 7Device and Documentation Support
    1. 7.1 接收文档更新通知
    2. 7.2 支持资源
    3. 7.3 商标
    4. 7.4 静电放电警告
    5. 7.5 术语表
  8. 8Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.2 Dissipation Ratings

PACKAGE TA ≤ 25°C
POWER RATING		 DERATING FACTOR(1)
ABOVE TA = 25°C		 TA = 70°C
POWER RATING		 TA = 85°C
POWER RATING		 TA = 125°C
POWER RATING
D 725 mW 5.5 mW/°C 464 mW 377 mW 145 mW
P 1000 mW 8.0 mW/°C 640 mW 520 mW —
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.