ZHCSRU5F September   2005  – March 2023 SN65HVD50 , SN65HVD52 , SN65HVD53 , SN65HVD54 , SN65HVD55

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Available Options
  6. 6 Pin Configurations
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Electrostatic Discharge Protection
    4. 7.4 Driver Electrical Characteristics
    5. 7.5 Driver Switching Characteristics
    6. 7.6 Receiver Electrical Characteristics
    7. 7.7 Receiver Switching Characteristics
    8. 7.8 Thermal Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Device Information
    1. 9.1 Ll-Power Standby Mode
    2. 9.2 Function Tables
    3. 9.3 Equivalent Input and Output Schematic Diagrams
  10. 10Application and Implementation
    1. 10.1 Thermal Characteristics of IC Packages
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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7.8 Thermal Characteristics

over operating free-air temperature range unless otherwise noted(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
θJA Junction−to−ambient thermal resistance Low-K board HVD51 230.8 °C/W
HVD53, HVD54, HVD55, HVD52, HVD50 -
Junction−to−ambient thermal resistance High-K board HVD51 135.1

HVD50, HVD52

 116.7
HVD53, HVD54, HVD55 93.2
θJB Junction−to−board thermal resistance High-K board HVD51 44.4
HVD50, HVD52 63.4
HVD53, HVD54, HVD55 49.4
θJC Junction−to−case thermal resistance No board HVD51 43.5
HVD50, HVD52 56.3
HVD53, HVD54, HVD55 47.5
PD Device power dissipation RL= 60Ω, CL = 50 pF,
Input to D a 50% duty cycle square wave at indicated signaling rate		 HVD50 (25Mbps) 420 mW
HVD51 (10Mbps) 404
HVD52 (1Mbps) 383
RL= 60Ω, CL = 50 pF,
DE at VCCRE at 0 V,
Input to D a 50% duty cycle square wave at indicated signaling rate		 HVD53 (25Mbps) 420
HVD54 (10Mbps) 404
HVD55 (1Mbps) 383
TA Ambient air temperature Low-K board, No airflow HVD50 –40 55 °C
HVD51, HVD52 –40 84
HVD53, HVD54, HVD55 –40 85
High-K board, No airflow HVD50, HVD51, HVD52 –40 85
HVD53, HVD54, HVD55 –40 85
TJSD Thermal shutdown junction temperature 165
(1) See Application Information section for an explanation of these parameters.