ZHCSAT8G september   2012  – october 2020 SN65DSI85

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings #GUID-24B27461-2407-4A70-B6CA-5D1E4961612D/SLLSEB91839
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  8.   Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Clock Configurations and Multipliers
      2. 7.3.2 ULPS
      3. 7.3.3 LVDS Pattern Generation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
      2. 7.4.2 24
      3. 7.4.3 Reset Implementation
      4. 7.4.4 Initialization Sequence
      5. 7.4.5 LVDS Output Formats
      6. 7.4.6 DSI Lane Merging
      7. 7.4.7 DSI Pixel Stream Packets
      8. 7.4.8 DSI Video Transmission Specifications
    5. 7.5 Programming
      1. 7.5.1 Local I2C Interface Overview
    6. 7.6 Register Maps
      1. 7.6.1 Control and Status Registers Overview
  10. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Video STOP and Restart Sequence
      2. 8.1.2 Reverse LVDS Pin Order Option
      3. 8.1.3 IRQ Usage
    2. 8.2 Typical Applications
      1. 8.2.1 Typical WUXGA 18-bpp Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Example Script
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Typical WQXGA 24-bpp Application
        1. 8.2.2.1 Design Requirements
  11. 9 Power Supply Recommendations
    1. 9.1 VCC Power Supply
    2. 9.2 VCORE Power Supply
  12. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Package Specific
      2. 10.1.2 Differential pairs
      3. 10.1.3 Ground
    2. 10.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
  14. 12Mechanical, Packaging, and Orderable Information

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5 Pin Configuration and Functions

GUID-09D9EE00-60A1-4DE0-8D11-C62144CAB65C-low.svg
To minimize the power supply noise floor, provide good decoupling near the SN65DSI85 power pins. The use of four ceramic capacitors (2x 0.1 μF and 2x 0.01 μF) provides good performance. At the least, it is recommended to install one 0.1 μF and one 0.01 μF capacitor near the SN65DSI85. To avoid large current loops and trace inductance, the trace length between decoupling capacitor and device power inputs pins must be minimized. Placing the capacitor underneath the SN65DSI85 on the bottom of the PCB is often a good choice.
Figure 5-1 ZXH Package64-Pin nFBGA(Top View)
Table 5-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
ADDR A1 CMOS Input/Output Local I2C Interface Target Address Select. See Table 7-6. In normal operation this pin is an input. When the ADDR pin is programmed high, it should be tied to the same 1.8 V power rails where the SN65DSI85 VCC 1.8 V power rail is connected.
A_Y0N C9 LVDS Output FlatLink™ Channel A LVDS Data Output 0.
A_Y0P C8
A_Y1N D9 FlatLink™ Channel A LVDS Data Output 1.
A_Y1P D8
A_Y2N E9 FlatLink™ Channel A LVDS Data Output 2.
A_Y2P E8
A_Y3N G9 FlatLink™ Channel A LVDS Data Output 3. A_Y3P and A_Y3N shall be left NC for 18 bpp panels.
A_Y3P G8
A_CLKN F9 FlatLink™ Channel A LVDS Clock
A_CLKP F8
B_Y0N A3 FlatLink™ Channel B LVDS Data Output 0.
B_Y0P B3
B_Y1N A4 FlatLink™ Channel B LVDS Data Output 1.
B_Y1P B4
B_Y2N A5 FlatLink™ Channel B LVDS Data Output 2.
B_Y2P B5
B_Y3N A7 FlatLink™ Channel B LVDS Data Output 3. B_Y3P and B_Y3N shall be left NC for 18 bpp panels.
B_Y3P B7
B_CLKN A6 FlatLink™ Channel B LVDS Clock.
B_CLKP B6
DA0N J3 LVDS Input (HS)
CMOS Input (LS)
(Failsafe)		 MIPI® D-PHY Channel A Data Lane 0; data rate up to 1 Gbps.
DA0P H3
DA1N J4 MIPI® D-PHY Channel A Data Lane 1; data rate up to 1 Gbps.
DA1P H4
DA2N J6 MIPI® D-PHY Channel A Data Lane 2; data rate up to 1 Gbps.
DA2P H6
DA3N J7 MIPI® D-PHY Channel A Data Lane 3; data rate up to 1 Gbps.
DA3P H7
DACN J5 MIPI® D-PHY Channel A Clock Lane; operates up to 500 MHz.
DACP H5
DB0N C1 MIPI® D-PHY Channel B Data Lane 0; data rate up to 1 Gbps.
DB0P C2
DB1N D1 MIPI® D-PHY Channel B Data Lane 1; data rate up to 1 Gbps.
DB1P D2
DB2N F1 MIPI® D-PHY Channel B Data Lane 2; data rate up to 1 Gbps.
DB2P F2
DB3N G1 MIPI® D-PHY Channel B Data Lane 3; data rate up to 1 Gbps.
DB3P G2
DBCN E1 MIPI® D-PHY Channel B Clock Lane; operates up to 500 MHz.
DBCP E2
EN B1 CMOS Input with pullup (Failsafe) Chip Enable and Reset. Device is reset (shutdown) when EN is low.
GND A2, A8, B9, D5, E4, F4, F5, H9 Power Supply Reference Ground.
IRQ J9 CMOS Output Interrupt Signal.
RSVD1 H8 CMOS Input/Output with pulldown Reserved. This pin should be left unconnected for normal operation.
RSVD2 B2 CMOS Input with pulldown Reserved. This pin should be left unconnected for normal operation.
REFCLK H2 CMOS Input (Failsafe) Optional External Reference Clock for LVDS Pixel Clock. If an External Reference Clock is not used, this pin should be pulled to GND with an external resistor. The source of the reference clock should be placed as close as possible with a series resistor near the source to reduce EMI.
SCL H1 Local I2C Interface Clock.
SDA J1 Open Drain Input/Output (Failsafe) Local I2C Interface Bi-directional Data Signal.
VCC A9, B8, D6, E5, E6, F6, J2 Power Supply 1.8 V Power Supply.
VCORE J8 1.1 V Output from Voltage Regulator. This pin must have a 1 µF external capacitor to GND.