ZHCSAU2G September   2012  – June 2018 SN65DSI84

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     典型应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 EDS Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Clock Configurations and Multipliers
      2. 7.3.2 ULPS
      3. 7.3.3 LVDS Pattern Generation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset Implementation
      2. 7.4.2 Initialization Sequence
      3. 7.4.3 LVDS Output Formats
      4. 7.4.4 DSI Lane Merging
      5. 7.4.5 DSI Pixel Stream Packets
      6. 7.4.6 DSI Video Transmission Specifications
      7. 7.4.7 Operating Modes
    5. 7.5 Programming
      1. 7.5.1 Local I2C Interface Overview
    6. 7.6 Register Maps
      1. 7.6.1 Control and Status Registers Overview
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Video Stop and Restart Sequence
      2. 8.1.2 Reverse LVDS Pin Order Option
      3. 8.1.3 IRQ Usage
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Example Script
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 VCC Power Supply
    2. 9.2 VCORE Power Supply
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Package Specific
      2. 10.1.2 Differential Pairs
      3. 10.1.3 Ground
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1.1 Package Specific

For the ZQE package, to minimize the power supply noise floor, provide good decoupling near the SN65DSI83 device power pins. The use of four ceramic capacitors (2 × 0.1 μF and 2 × 0.01 μF) provides good performance. At the least, TI recommends to install one 0.1-μF and one 0.01-μF capacitor near the SN65DSI83 device. To avoid large current loops and trace inductance, the trace length between decoupling capacitor and device power inputs pins must be minimized. Placing the capacitor underneath the SN65DSI83 device on the bottom of the PCB is often a good choice.