ZHCSPX1C March 2003 – June 2022 SN54HC109 , SN74HC109
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
THERMAL METRIC | D (SOIC) | N (PDIP) | NS (SO) | UNIT | |
---|---|---|---|---|---|
16 PINS | 16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance(1) | 117.2 | 60.5 | 88.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 77.2 | 47.9 | 45.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 75.6 | 40.4 | 50.9 | °C/W |
ψJT | Junction-to-top characterization parameter | 38.1 | 27.3 | 12.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 75.3 | 40.2 | 50.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |