SLOS075J November   1979  – January 2015 NE5532 , NE5532A , SA5532 , SA5532A

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematic
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Unity-Gain Bandwidth
      2. 8.3.2 Common-Mode Rejection Ratio
      3. 8.3.3 Slew Rate
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Design Requirements
      2. 9.1.2 Detailed Design Procedure
        1. 9.1.2.1 Amplifier Selection
        2. 9.1.2.2 Passive Component Selection
      3. 9.1.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
      1. 12.1.1 Trademarks
      2. 12.1.2 Electrostatic Discharge Caution
    2. 12.2 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage(2) VCC+ 0 22 V
VCC– –22 0 V
Input voltage, either input(2)(3) VCC– VCC+ V
Input current(4) –10 10 mA
Duration of output short circuit(5) Unlimited
TJ Operating virtual-junction temperature 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC–.
(3) The magnitude of the input voltage must never exceed the magnitude of the supply voltage.
(4) Excessive input current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless some limiting resistance is used.
(5) The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure the maximum dissipation rating is not exceeded.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN MAX UNIT
VCC+ Supply voltage 5 15 V
VCC– Supply voltage –5 –15 V
TA Operating free-air temperature NE5532, NE5532A 0 70 °C
SA5532, SA5532A –40 85

7.4 Thermal Information

THERMAL METRIC(1) NE5532, NE5532A, SA5532, and SA5532A UNIT
D P PS
8 PINS
RθJA Junction-to-ambient thermal resistance (3)(2) 97 85 95 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA) / θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.

7.5 Electrical Characteristics

VCC± = ±15 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
VIO Input offset voltage VO = 0 TA = 25°C 0.5 4 mV
TA = Full range(2) 5
IIO Input offset current TA = 25°C 10 150 nA
TA = Full range(2) 200
IIB Input bias current TA = 25°C 200 800 nA
TA = Full range(2) 1000
VICR Common-mode input-voltage range ±12 ±13 V
VOPP Maximum peak-to-peak output-voltage swing RL ≥ 600 Ω, VCC± = ±15 V 24 26 V
AVD Large-signal differential-voltage amplification RL ≥ 600 Ω, VO = ±10 V TA = 25°C 15 50 V/mV
TA = Full range(2) 10
RL ≥ 2 kΩ, VO±10 V TA = 25°C 25 100
TA = Full range(2) 15
Avd Small-signal differential-voltage amplification f = 10 kHz 2.2 V/mV
BOM Maximum output-swing bandwidth RL = 600 Ω, VO = ±10 V 140 kHz
B1 Unity-gain bandwidth RL = 600 Ω, CL = 100 pF 10 MHz
ri Input resistance 30 300
zo Output impedance AVD = 30 dB, RL = 600 Ω, f = 10 kHz 0.3 Ω
CMRR Common-mode rejection ratio VIC = VICR min 70 100 dB
kSVR Supply-voltage rejection ratio (ΔVCC±/ΔVIO) VCC± = ±9 V to ±15 V, VO = 0 80 100 dB
IOS Output short-circuit current 10 38 60 mA
ICC Total supply current VO = 0, No load 8 16 mA
Crosstalk attenuation (VO1/VO2) V01 = 10 V peak, f = 1 kHz 110 dB
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
(2) Full temperature ranges are: –40°C to 85°C for the SA5532 and SA5532A devices, and 0°C to 70°C for the NE5532 and NE5532A devices.

7.6 Operating Characteristics

VCC± = ±15 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS NE5532, SA5532 NE5532A, SA5532A UNIT
MIN TYP MAX MIN TYP MAX
SR Slew rate at unity gain 9 9 V/μs
Overshoot factor VI = 100 mV,
RL = 600 Ω,
AVD = 1,
CL = 100 pF
10 10 %
Vn Equivalent input noise voltage f = 30 Hz 8 8 10 nV/√Hz
f = 1 kHz 5 5 6
In Equivalent input noise current f = 30 Hz 2.7 2.7 pA/√Hz
f = 1 kHz 0.7 0.7

7.7 Typical Characteristics

D001_SLOS075.gifFigure 1. Equivalent Input Noise Voltage vs Frequency
D003_SLOS075.gifFigure 3. Output Swing Bandwidth
vs Temperature at VCC = ±10 V
D002_SLOS075.gifFigure 2. Equivalent Input Noise Current vs Frequency