ZHCSQY6D august   2022  – april 2023 OPA2992-Q1 , OPA4992-Q1 , OPA992-Q1

PRODMIX  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Protection Circuitry
      2. 7.3.2 EMI Rejection
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Capacitive Load and Stability
      5. 7.3.5 Common-Mode Voltage Range
      6. 7.3.6 Phase Reversal Protection
      7. 7.3.7 Electrical Overstress
      8. 7.3.8 Overload Recovery
      9. 7.3.9 Typical Specifications and Distributions
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Low-Side Current Measurement
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 TINA-TI (Free Software Download)
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (February 2023) to Revision D (April 2023)

  • 将 14 引脚 SOIC (D) 和 TSSOP (PW) 封装的状态从预发布 更改为正在供货 Go

Changes from Revision B (January 2023) to Revision C (February 2023)

  • 将 5 引脚 SOT-23 和 8 引脚 SOIC 封装的状态从预发布 更改为正在供货 Go

Changes from Revision A (December 2022) to Revision B (January 2023)

  • 删除了 SC70-5 (DCK) 封装的预发布标签Go
  • Added OPA992-Q1 to the ESD Ratings section Go
  • Changed the values in the Thermal Information table Go
  • Changed the max room temp offset voltage in Electrical Characteristics section from 1 mV to 1.03 mVGo

Changes from Revision * (August 2022) to Revision A (December 2022)

  • 将器件状态从预告信息 更改为 ProdMix Go
  • 删除了 VSSOP-8 (DGK) 封装的预发布标签Go