ZHCSOI9B
July 2022 – December 2024
OPA817
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics: VS = ±5 V
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Input and ESD Protection
7.3.2
Feedback Pin
7.3.3
FET-Input Architecture With Wide Gain-Bandwidth Product
7.4
Device Functional Modes
7.4.1
Power-Down (PD) Pin
8
Application and Implementation
8.1
Application Information
8.1.1
Wideband, High-Input-Impedance DAQ Front End
8.2
Typical Applications
8.2.1
High-Input-Impedance, 200-MHz, Digitizer Front-End Amplifier Design
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.1.1
Thermal Considerations
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Device Support
9.1.1
Development Support
9.2
Documentation Support
9.2.1
Related Documentation
9.3
接收文档更新通知
9.4
支持资源
9.5
Trademarks
9.6
静电放电警告
9.7
术语表
10
Revision History
11
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
DTK|8
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsoi9b_oa
zhcsoi9b_pm
8.4.2
Layout Example
Figure 8-6
Layout Recommendation