SBOS293H December   2003  – December 2015 OPA695

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Differential Small Signal Measurement
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Wideband Current Feedback Operation
      2. 8.3.2 RF Specifications and Applications
      3. 8.3.3 Input Return Loss (S11)
      4. 8.3.4 Output Return Loss (S22)
      5. 8.3.5 Forward Gain (S21)
      6. 8.3.6 Reverse Isolation (S12)
      7. 8.3.7 Limits to Dynamic Range
        1. 8.3.7.1 -1-dB Compression
        2. 8.3.7.2 Two-Tone 3rd-Order Output Intermodulation Intercept (OP3)
        3. 8.3.7.3 Noise Figure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 SAW Filter Buffer
      2. 9.1.2 LO Buffer Amplifier
      3. 9.1.3 Wideband Cable Driving Applications
        1. 9.1.3.1 Cable Modem Return Path Driver
        2. 9.1.3.2 RGB Video Line Driver
        3. 9.1.3.3 Arbitrary Waveform Driver
      4. 9.1.4 Differential I/O Applications
      5. 9.1.5 Operating Suggestions
        1. 9.1.5.1 Setting Resistor Values to Optimize Bandwidth
        2. 9.1.5.2 Output Current and Voltage
        3. 9.1.5.3 Driving Capacitive Loads
        4. 9.1.5.4 Distortion Performance
        5. 9.1.5.5 Noise Performance
        6. 9.1.5.6 DC Accuracy and Offset Control
        7. 9.1.5.7 Power Shutdown Operation
        8. 9.1.5.8 Thermal Analysis
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Saw Filter Buffer
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Input and ESD Protection
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Design-In Tools
        1. 12.1.1.1 Demonstration Fixtures
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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4 Revision History

Changes from G Revision (April 2009) to H Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Removed lead temperature Go

Changes from F Revision (July 2006) to G Revision

  • Added DGK (MSOP-8) package to Package Ordering Information table and to Thermal Resistance specification in the Electrical Characteristics tables.Go

Changes from E Revision (March 2006) to F Revision

  • Changed Storage Temperature Range from −40°C to +125C to −65°C to +125C. Go