SBOS223G December   2001  – August 2016 OPA690

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±5 V
    6. 7.6 Electrical Characteristics: VS = 5 V
    7. 7.7 Typical Characteristics
      1. 7.7.1 Typical Characteristics: VS = ±5 V
      2. 7.7.2 Typical Characteristics: 5 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Wideband Voltage-Feedback Operation
      2. 8.3.2 Bandwidth Versus Gain: Noninverting Operation
      3. 8.3.3 Inverting Amplifier Operation
      4. 8.3.4 Output Current and Voltage
      5. 8.3.5 Driving Capacitive Loads
      6. 8.3.6 Distortion Performance
      7. 8.3.7 Noise Performance
      8. 8.3.8 DC Accuracy and Offset Control
    4. 8.4 Device Functional Modes
      1. 8.4.1 Disable Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Optimizing Resistor Values
      2. 9.1.2 Thermal Analysis
    2. 9.2 Typical Applications
      1. 9.2.1 Single-Supply ADC Interface
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Single-Supply Active Filters
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Application Curve
      3. 9.2.3 High-Performance DAC Transimpedance Amplifier
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
      4. 9.2.4 High-Power Line Driver
        1. 9.2.4.1 Design Requirements
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Input and ESD Protection
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Macromodels and Applications Support
      2. 12.1.2 Demonstration Fixtures
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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12 Device and Documentation Support

12.1 Device Support

12.1.1 Macromodels and Applications Support

Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. This is particularly true for video and RF amplifier circuits where parasitic capacitance and inductance can have a major effect on circuit performance. A SPICE model for the OPA690 is available through the OPA690 product folder under Simulation Models. These models do a good job of predicting small-signal ac and transient performance under a wide variety of operating conditions. They do not do as well in predicting the harmonic distortion or dG/dP characteristics. These models do not attempt to distinguish between the package types in their small-signal ac performance.

12.1.2 Demonstration Fixtures

Two printed-circuit boards (PCBs) are available to assist in the initial evaluation of circuit performance using the OPA690 in its two package options. Both of these are offered free of charge as unpopulated PCBs, delivered with a user’s guide. The summary information for these fixtures is shown in Table 1.

Table 1. Demonstration Fixtures by Package

PRODUCT PACKAGE ORDERING
NUMBER		 LITERATURE
NUMBER
OPA690ID 8-pin SOIC DEM-OPA-SO-1A SBOU009
OPA690IDBV 6-pin SOT-23 DEM-OPA-SOT-1A SBOU010

The demonstration fixtures can be requested at the Texas Instruments web site (www.ti.com) through the OPA690 product folder.

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.