SBOS206F January   2001  – October 2023 OPA561

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Feature Description
      1. 6.2.1 Adjustable Current Limit
        1. 6.2.1.1 Current Limit Accuracy
        2. 6.2.1.2 Setting the Current Limit
      2. 6.2.2 Enable-Status (E/S) Pin
        1. 6.2.2.1 Output Disable
        2. 6.2.2.2 Maintaining Microcontroller Compatibility
      3. 6.2.3 Overcurrent Flag
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Output Stage Compensation
      2. 7.1.2 Output Protection
      3. 7.1.3 Thermal Protection
      4. 7.1.4 Power Dissipation
      5. 7.1.5 Heat-Sink Area
      6. 7.1.6 Amplifier Mounting
        1. 7.1.6.1 What is the PowerPAD™ Integrated Circuit Package?
        2. 7.1.6.2 PowerPAD™ Integrated Circuit Package Assembly Process
    2. 7.2 Typical Application
      1. 7.2.1 Laser Diode Driver
      2. 7.2.2 Programmable Power Supply
      3. 7.2.3 Power-Line Communication Modem
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PWP|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

Typical Characteristics

at TCASE = 25°C, VS = 15 V, and E/S enabled (unless otherwise noted)

GUID-20230614-SS0I-5R8N-X9D1-72WF5QGM8NP0-low.svg
 
Figure 5-1 Gain and Phase vs Frequency
GUID-20230614-SS0I-CCMS-W6HL-V6BRH5RJQVQT-low.svg
 
Figure 5-3 Maximum Output Amplitude vs Frequency
GUID-20230614-SS0I-KHPL-MLMC-NWR9WPZT0FTR-low.svg
 
Figure 5-5 Input Voltage Spectral Noise vs Frequency
GUID-20230614-SS0I-PJPJ-B8TC-FPS0KGM0QW2J-low.svg
 
Figure 5-7 AOL, PSRR, and CMRR vs Temperature
GUID-20230614-SS0I-6LNZ-JSBD-1ZZN4FZ5BT8M-low.svg
 
Figure 5-9 IB vs Temperature
GUID-20230614-SS0I-D2JT-5BWG-CFXGDNCXMWSZ-low.svg
 
Figure 5-11 Output Voltage Swing vs Output Current
GUID-20230614-SS0I-XK98-FJKX-KXZNT2PWM4WX-low.svg
 
Figure 5-13 Small-Signal Step Response
GUID-20230614-SS0I-MVFG-QXMN-6QD5XSZZG1CK-low.svg
RL = 5 Ω
Figure 5-15 Shutdown Response
GUID-20230614-SS0I-DVGD-R5JJ-LKNJ1WVTVNZQ-low.svg
 
Figure 5-17 Offset Voltage Production Distribution
GUID-20230614-SS0I-J5RC-NKWC-XBPCGJ3K083H-low.svg
 
Figure 5-2 Common-Mode Rejection Ratio, Power-Supply Rejection Ratio vs Frequency
GUID-20230614-SS0I-3TPS-FC7R-H6H2ST4HLCHW-low.svg
 Unity gain follower, load = 5 Ω
Figure 5-4 Total Harmonic Distortion + Noise vs Frequency
GUID-20230614-SS0I-ZZLN-XLL7-GFJWTCGNWTBK-low.svg
 
Figure 5-6 Small-Signal Overshoot vs Load Capacitance
GUID-20230614-SS0I-STS5-NNT3-MVHL53HDHKN7-low.svg
 
Figure 5-8 IQ vs Temperature
GUID-20230614-SS0I-RC8Z-N0QL-NL4B0HG3DBX8-low.svg
 
Figure 5-10 Slew Rate vs Temperature
GUID-20230614-SS0I-JFP0-RZ7P-VRQJTLH47TVF-low.svg
 
Figure 5-12 Quiescent Current vs Supply Voltage
GUID-20230614-SS0I-FWKQ-WW9S-JKHWRP5DXTDX-low.svg
 
Figure 5-14 Large-Signal Step Response
GUID-20230614-SS0I-G3MN-D9MM-SG7P1P6NMF0Z-low.svg
RL = 5 Ω
Figure 5-16 Enable Response