ZHCSSC0F January   2001  – October 2023 OPA561

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Feature Description
      1. 6.2.1 Adjustable Current Limit
        1. 6.2.1.1 Current Limit Accuracy
        2. 6.2.1.2 Setting the Current Limit
      2. 6.2.2 Enable-Status (E/S) Pin
        1. 6.2.2.1 Output Disable
        2. 6.2.2.2 Maintaining Microcontroller Compatibility
      3. 6.2.3 Overcurrent Flag
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Output Stage Compensation
      2. 7.1.2 Output Protection
      3. 7.1.3 Thermal Protection
      4. 7.1.4 Power Dissipation
      5. 7.1.5 Heat-Sink Area
      6. 7.1.6 Amplifier Mounting
        1. 7.1.6.1 What is the PowerPAD™ Integrated Circuit Package?
        2. 7.1.6.2 PowerPAD™ Integrated Circuit Package Assembly Process
    2. 7.2 Typical Application
      1. 7.2.1 Laser Diode Driver
      2. 7.2.2 Programmable Power Supply
      3. 7.2.3 Power-Line Communication Modem
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方产品免责声明
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision E (February 2007) to Revision F (October 2023)

  • 更新了整个文档的表、图和交叉参考的编号格式Go
  • 添加了封装信息 表以及引脚配置和功能规格ESD 等级建议运行条件热性能信息详细说明概述特性说明应用和实现典型应用电源相关建议布局器件和文档支持机械、封装和可订购信息 部分Go
  • 将整个数据表中的最低工作温度从 –40ºC 更改为 0°CGo
  • Updated input offset voltage typical value in Electrical Characteristics Go
  • Updated to correct unit in Figure 6-11, Output Voltage Swing vs Output Current Go
  • Updated to correct unit in Figure 6-17, Offset Voltage Production Distribution Go
  • Added "approximately" to text referring to thermal protection behaviorGo
  • Added missing Equation 2Go