ZHCSFL2D October 2016 – June 2019 OPA2325 , OPA325 , OPA4325
PRODUCTION DATA.
| THERMAL METRIC(1) | OPA325 | UNIT | |
|---|---|---|---|
| DBV (SOT) | |||
| 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 205 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 200 | °C/W |
| RθJB | Junction-to-board thermal resistance | 113 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 38.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 104.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |