ZHCSF85A July   2016  – December 2019 OPA2626

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      SAR ADC 驱动器
      2.      高保真拓扑改善了动态性能 (fIN = 10kHz,1MSPS FFT)
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions: OPA2626
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: High-Supply
    6. 6.6 Electrical Characteristics: Low-Supply
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 DC Parameter Measurements
    2. 7.2 Transient Parameter Measurements
    3. 7.3 AC Parameter Measurements
    4. 7.4 Noise Parameter Measurements
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 SAR ADC Driver
      2. 8.3.2 Electrical Overstress
    4. 8.4 Device Functional Modes
      1. 8.4.1 High-Drive Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Single-Supply, 16-Bit, 1-MSPS SAR ADC Driver
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Single-Supply, 16-Bit, 1-MSPS, Multiplexed, SAR ADC Driver
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
        1. 12.1.1.1 TINA-TI(免费软件下载)
        2. 12.1.1.2 TI 高精度设计
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Overstress

Designers often ask questions about the capability of an operational amplifier to withstand electrical overstress (EOS). These questions tend to focus on the device inputs, but may involve the supply voltage pins or even the output pin. Each of these different pin functions have electrical stress limits determined by the voltage breakdown characteristics of the particular semiconductor fabrication process and specific circuits connected to the pin. Additionally, internal electrostatic discharge (ESD) protection is built into these circuits to protect them from accidental ESD events both before and during product assembly. A good understanding of this basic ESD circuitry and how the ESD circuitry relates to an electrical overstress event is helpful. Figure 60 provides a diagram of the ESD circuits contained in the OPA2626. The ESD protection circuitry involves several current-steering diodes connected from the input and output pins and routed back to the internal power-supply lines, where the diodes meet at an absorption device or the power-supply ESD cell, internal to the operational amplifier. This protection circuitry is intended to remain inactive during normal circuit operation.

OPA2626 ESD_SCH_SBOS690.gifFigure 60. Simplified ESD Circuit