ZHCSFL2D October   2016  – June 2019 OPA2325 , OPA325 , OPA4325

PRODUCTION DATA.  

  1. 特性
  2. 应用
    1.     失调电压与输入共模电压间的关系
  3. 说明
    1.     可用作 ADC 驱动放大器的 OPAx325
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions: OPA325
    2.     Pin Functions: OPA2325
    3.     Pin Functions: OPA4325
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA325
    5. 6.5 Thermal Information: OPA2325
    6. 6.6 Thermal Information: OPA4325
    7. 6.7 Electrical Characteristics: VS = 2.2 V to 5.5 V or ±1.1 V to ±2.75 V
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Zero-Crossover Input Stage
      2. 7.3.2 Low Input Offset Voltage
      3. 7.3.3 Input and ESD Protection
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Operating Characteristics
      2. 8.1.2 Basic Amplifier Configurations
      3. 8.1.3 Driving an Analog-to-Digital Converter
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 相关链接
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information: OPA4325

THERMAL METRIC(1) OPA4325 UNIT
PW (TSSOP)
14 PINS
RθJA Junction-to-ambient thermal resistance 93 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 28 °C/W
RθJB Junction-to-board thermal resistance 34 °C/W
ΨJT Junction-to-top characterization parameter 1.9 °C/W
ΨJB Junction-to-board characterization parameter 33.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.