ZHCSJH0C March   2019  – September 2022 OPA1655 , OPA1656

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA1655
    5. 6.5 Thermal Information: OPA1656
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Phase Reversal Protection
      2. 7.3.2 Electrical Overstress
      3. 7.3.3 EMI Rejection Ratio (EMIRR)
        1. 7.3.3.1 EMIRR IN+ Test Configuration
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Noise Calculations
    2. 8.2 Typical Applications
      1. 8.2.1 Preamplifier Circuit for Vinyl Record Playback With Moving-Magnet Phono Cartridges
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Composite Headphone Amplifier
        1. 8.2.2.1 Application Curves
      3. 8.2.3 Baxandall Tone Control
        1. 8.2.3.1 Application Curves
      4. 8.2.4 Guitar Input to XLR Output
        1. 8.2.4.1 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
      2. 8.4.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 9.1.1.3 DIP-Adapter-EVM
        4. 9.1.1.4 DIYAMP-EVM
        5. 9.1.1.5 TI Reference Designs
        6. 9.1.1.6 Filter Design Tool
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

Figure 5-1 OPA1655 D (8-Pin SOIC) Package, Top View
GUID-94080CA9-28F9-4D96-8719-BC1CB4178FF2-low.gifFigure 5-2 OPA1655 DBV (5-Pin SOT-23) Package, Top View
Pin Functions: OPA1655
PIN TYPE DESCRIPTION
NAME NO.
D (SOIC) DBV (SOT-23)
–IN 2 4 Input Inverting input
+IN 3 3 Input Noninverting input
OUT 6 1 Output Output
V– 4 2 Power Negative (lowest) power supply
V+ 7 5 Power Positive (highest) power supply
GUID-AB1C9EEA-39F7-4459-8A58-C295F9E038E0-low.gif Figure 5-3 OPA1656 D (8-Pin SOIC) Package, Top View
Pin Functions: OPA1656
PIN TYPE DESCRIPTION
NAME NO.
–IN A 2 Input Inverting input, channel A
+IN A 3 Input Noninverting input, channel A
–IN B 6 Input Inverting input, channel B
+IN B 5 Input Noninverting input, channel B
OUT A 1 Output Output, channel A
OUT B 7 Output Output, channel B
V– 4 Power Negative (lowest) power supply
V+ 8 Power Positive (highest) power supply