SLVSIQ9 February   2026 MSPM0G1218

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      10
    3. 6.3 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF1
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 VREF2
      1. 7.15.1 Voltage Characteristics
      2. 7.15.2 Electrical Characteristics
    16. 7.16 Comparator (COMP)
      1. 7.16.1 Comparator Electrical Characteristics
    17. 7.17 I2C
      1. 7.17.1 I2C Characteristics
      2. 7.17.2 I2C Filter
      3. 7.17.3 I2C Timing Diagram
    18. 7.18 SPI
      1. 7.18.1 SPI
      2. 7.18.2 SPI Timing Diagram
    19. 7.19 UART
    20. 7.20 TIMx
    21. 7.21 TRNG
      1. 7.21.1 TRNG Electrical Characteristics
    22. 7.22 Emulation and Debug
      1. 7.22.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Functional Block Diagram
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0Gx218, MSPM0Gx207, MSPM0G122x)
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripherals Summary
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 VREF
    16. 8.16 COMP
    17. 8.17 Security
    18. 8.18 AESADV
    19. 8.19 Keystore
    20. 8.20 CRC-P
    21. 8.21 MATHACL
    22. 8.22 UNICOMM (UART/SPI/I2C)
      1. 8.22.1 UART (UNICOMM)
      2. 8.22.2 I2C (UNICOMM)
      3. 8.22.3 SPI (UNICOMM)
    23. 8.23 UART
    24. 8.24 I2C
    25. 8.25 SPI
    26. 8.26 CAN-FD
    27. 8.27 Low-Frequency Sub System (LFSS)
    28. 8.28 RTC_B
    29. 8.29 IWDT_B
    30. 8.30 WWDT
    31. 8.31 Timers (TIMx)
    32. 8.32 Input/Output Diagrams
    33. 8.33 Device Analog Connections
    34. 8.34 Serial Wire Debug Interface
    35. 8.35 Boot Strap Loader (BSL)
    36. 8.36 Device Factory Constants
    37. 8.37 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

5 Device Comparison

The following table summarizes the features of each device that is described in this data sheet.

Table 5-1 Device Comparison Table

DEVICE NAME(1)(4)

FLASH / SRAM (KB)

QUAL(2)

CAN

 UART/I2C/SPI ADC / CHAN COMP GPIO

PACKAGE(3)

MSPM0G3218SPMR

256 / 32

S

 1 4 / 2 / 2 2 / 27 2 60

64 LQFP
(0.5mm pitch)
[12mm x 12mm]

MSPM0G3207SPMR

128 / 32

S

 1 4 / 2 / 2 1 / 13 1 60

MSPM0G1218SPMR

256 / 32

S

 0 4 / 2 / 2 2 / 27 2 60

MSPM0G1207SPMR

 128 / 32

S

 0 4 / 2 / 2 1 / 13 1 60

MSPM0G3218SPTR

256 / 128

S

1

 4 / 2 / 2 2 / 21 2 44

48 LQFP
(0.5mm pitch)
[9mm x 9mm]

MSPM0G3207SPTR

128 / 32

S

1

 4 / 2 / 2 1 / 12 1 44

MSPM0G1218SPTR

256 / 32

S

0

 4 / 2 / 2 2 / 21 2 44

MSPM0G1207SPTR

128 / 32

S

0

 4 / 2 / 2 1 / 12 1 44

MSPM0G3218SRGZR

256 / 32

S

1

 4 / 2 / 2 2 / 21 2 44

48 VQFN
(0.5mm pitch)
[7mm x 7mm]

MSPM0G3207SRGZR

128 / 32

S

1

 4 / 2 / 2 1 / 12 1 44

MSPM0G1218SRGZR

256 / 32

S

0

 4 / 2 / 2 2 / 21 2 44

MSPM0G1207SRGZR

128 / 32

S

0

 4 / 2 / 2 1 / 12 1 44

MSPM0G3218SRHBR

256 / 32

S

1

 4 / 2 / 2 2 / 16 2 28

32 VQFN
(0.5mm pitch)
[5mm x 5mm]

MSPM0G3207SRHBR

128 / 32

S

1

 4 / 2 / 2 1 / 10 1 28

MSPM0G1218SRHBR

256 / 32

S

0

 4 / 2 / 2 2 / 16 2 28

MSPM0G1207SRHBR

128 / 32

S

0

 4 / 2 / 2 1 / 10 1 28
MSPM0G1218SRUYR

256 / 32

 S 0 4 / 2 / 2 2 / 14 2 24

28 WQFN
(0.4mm pitch)
[4mm x 4mm]
MSPM0G1207SRUYR 128 / 32 S 0 4 / 2 / 2 1 / 8 1 24
MSPM0G1218S28DGSR

256 / 32

 S 0 4 / 2 / 2 2 / 10 2 24 28 VSSOP
(0.5mm pitch)
[7.1mm x 3.0mm]
MSPM0G1207S28DGSR 128 / 32 S 0 4 / 2 / 2 1 / 7 1 24
MSPM0G3218SRGER

256 / 32

 S 1 4 / 2 / 2 2 / 11 2 20 24 VQFN
(0.5mm pitch)
[4mm x 4mm]
MSPM0G3207SRGER 128 / 32 S 1 4 / 2 / 2 1 / 6 1 20
MSPM0G1218SRGER

256 / 32

 S 0 4 / 2 / 2 2 / 11 2 20
(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 12, or see the TI website.
(2) Device Qualifications:
  • S = –40°C to 125°C
(3) The package size (length × width) is a nominal value and includes pins, where applicable. For the package dimensions with tolerances, see Section 12.
(4) For more information about the device name, see Section 10.2