ZHCSER2D May   2013  – October 2020 MSP430F5252 , MSP430F5253 , MSP430F5254 , MSP430F5255 , MSP430F5256 , MSP430F5257 , MSP430F5258 , MSP430F5259

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Signal Descriptions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 8.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 8.6  Thermal Resistance Characteristics
    7. 8.7  Schmitt-Trigger Inputs – General-Purpose I/O DVCC Domain (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3, RSTDVCC)
    8. 8.8  Schmitt-Trigger Inputs – General-Purpose I/O DVIO Domain (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5, RST/NMI, BSLEN)
    9. 8.9  Inputs – Interrupts DVCC Domain Port P6 (P6.0 to P6.7)
    10. 8.10 Inputs – Interrupts DVIO Domain Ports P1 and P2 (P1.0 to P1.7, P2.0 to P2.7)
    11. 8.11 Leakage Current – General-Purpose I/O DVCC Domain (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    12. 8.12 Leakage Current – General-Purpose I/O DVIO Domain (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
    13. 8.13 Outputs – General-Purpose I/O DVCC Domain (Full Drive Strength) (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    14. 8.14 Outputs – General-Purpose I/O DVCC Domain (Reduced Drive Strength) (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    15. 8.15 Outputs – General-Purpose I/O DVIO Domain (Full Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
    16. 8.16 Outputs – General-Purpose I/O DVIO Domain (Reduced Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
    17. 8.17 Output Frequency – General-Purpose I/O DVCC Domain (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    18. 8.18 Output Frequency – General-Purpose I/O DVIO Domain (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
    19. 8.19 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    20. 8.20 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    21. 8.21 Crystal Oscillator, XT1, Low-Frequency Mode
    22. 8.22 Crystal Oscillator, XT2
    23. 8.23 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    24. 8.24 Internal Reference, Low-Frequency Oscillator (REFO)
    25. 8.25 DCO Frequency
    26. 8.26 PMM, Brownout Reset (BOR)
    27. 8.27 PMM, Core Voltage
    28. 8.28 PMM, SVS High Side
    29. 8.29 PMM, SVM High Side
    30. 8.30 PMM, SVS Low Side
    31. 8.31 PMM, SVM Low Side
    32. 8.32 Wake-up Times From Low-Power Modes and Reset
    33. 8.33 Timer_A
    34. 8.34 Timer_B
    35. 8.35 USCI (UART Mode) Clock Frequency
    36. 8.36 USCI (UART Mode)
    37. 8.37 USCI (SPI Master Mode) Clock Frequency
    38. 8.38 USCI (SPI Master Mode)
    39. 8.39 USCI (SPI Slave Mode)
    40. 8.40 USCI (I2C Mode)
    41. 8.41 10-Bit ADC, Power Supply and Input Range Conditions
    42. 8.42 10-Bit ADC, Timing Parameters
    43. 8.43 10-Bit ADC, Linearity Parameters
    44. 8.44 REF, External Reference
    45. 8.45 REF, Built-In Reference
    46. 8.46 Comparator_B
    47. 8.47 Flash Memory
    48. 8.48 JTAG and Spy-Bi-Wire Interface
    49. 8.49 DVIO BSL Entry
  9. 9 Detailed Description
    1. 9.1  CPU
    2. 9.2  Operating Modes
    3. 9.3  Interrupt Vector Addresses
    4. 9.4  Memory Organization
    5. 9.5  Bootloader (BSL)
      1. 9.5.1 Bootloader – I2C
      2. 9.5.2 Bootloader – UART
    6. 9.6  JTAG Operation
      1. 9.6.1 JTAG Standard Interface
      2. 9.6.2 Spy-Bi-Wire Interface
    7. 9.7  Flash Memory
    8. 9.8  RAM
    9. 9.9  Peripherals
      1. 9.9.1  Digital I/O
      2. 9.9.2  Port Mapping Controller
      3. 9.9.3  Oscillator and System Clock
      4. 9.9.4  Power-Management Module (PMM)
      5. 9.9.5  Hardware Multiplier
      6. 9.9.6  Real-Time Clock (RTC_A)
      7. 9.9.7  Watchdog Timer (WDT_A)
      8. 9.9.8  System Module (SYS)
      9. 9.9.9  DMA Controller
      10. 9.9.10 Universal Serial Communication Interface (USCI)
      11. 9.9.11 TA0
      12. 9.9.12 TA1
      13. 9.9.13 TA2
      14. 9.9.14 TB0
      15. 9.9.15 Comparator_B
      16. 9.9.16 ADC10_A
      17. 9.9.17 CRC16
      18. 9.9.18 Reference (REF) Module Voltage Reference
      19. 9.9.19 Embedded Emulation Module (EEM) (S Version)
      20. 9.9.20 Peripheral File Map
    10. 9.10 Input/Output Diagrams
      1. 9.10.1  Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 9.10.2  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 9.10.3  Port P3 (P3.0 to P3.4) Input/Output With Schmitt Trigger
      4. 9.10.4  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 9.10.5  Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
      6. 9.10.6  Port P5 (P5.2 and P5.3) Input/Output With Schmitt Trigger
      7. 9.10.7  Port P5 (P5.4 and P5.5) Input/Output With Schmitt Trigger
      8. 9.10.8  Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      9. 9.10.9  Port P7 (P7.0 to P7.5) Input/Output With Schmitt Trigger
      10. 9.10.10 Port J (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      11. 9.10.11 Port J (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    11. 9.11 Device Descriptors
  10. 10Device and Documentation Support
    1. 10.1  Getting Started and Next Steps
    2. 10.2  Device Nomenclature
    3. 10.3  Tools and Software
    4. 10.4  Documentation Support
    5. 10.5  Related Links
    6. 10.6  支持资源
    7. 10.7  Trademarks
    8. 10.8  静电放电警告
    9. 10.9  Export Control Notice
    10. 10.10 术语表
  11. 11Mechanical, Packaging, and Orderable Information

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9.11 Device Descriptors

Table 9-59 and Table 9-60 list the contents of the device descriptor tag-length-value (TLV) structure for each device type.

Table 9-59 MSP430F5259, MSP430F5257, MSP430F5255, MSP430F5253 Device Descriptor Table
DESCRIPTION(1) ADDRESS SIZE (bytes) VALUE
F5259 F5257 F5255 F5253
Info Block Info length 01A00h 1 06h 06h 06h 06h
CRC length 01A01h 1 06h 06h 06h 06h
CRC value 01A02h 2 Per unit Per unit Per unit Per unit
Device ID 01A04h 1 FF 01 03 05
Device ID 01A05h 1 81 82 82 82
Hardware revision 01A06h 1 Per unit Per unit Per unit Per unit
Firmware revision 01A07h 1 Per unit Per unit Per unit Per unit
Die Record Die record tag 01A08h 1 08h 08h 08h 08h
Die record length 01A09h 1 0Ah 0Ah 0Ah 0Ah
Lot/wafer ID 01A0Ah 4 Per unit Per unit Per unit Per unit
Die X position 01A0Eh 2 Per unit Per unit Per unit Per unit
Die Y position 01A10h 2 Per unit Per unit Per unit Per unit
Test results 01A12h 2 Per unit Per unit Per unit Per unit
ADC10 Calibration ADC10 calibration tag 01A14h 1 13h 13h 13h 13h
ADC10 calibration length 01A15h 1 10h 10h 10h 10h
ADC gain factor 01A16h 2 Per unit Per unit Per unit Per unit
ADC offset 01A18h 2 Per unit Per unit Per unit Per unit
ADC 1.5-V reference
Temperature sensor 30°C		 01A1Ah 2 Per unit Per unit Per unit Per unit
ADC 1.5-V reference
Temperature sensor 85°C		 01A1Ch 2 Per unit Per unit Per unit Per unit
ADC 2.0-V reference
Temperature sensor 30°C		 01A1Eh 2 Per unit Per unit Per unit Per unit
ADC 2.0-V reference
Temperature sensor 85°C		 01A20h 2 Per unit Per unit Per unit Per unit
ADC 2.5-V reference
Temperature sensor 30°C		 01A22h 2 Per unit Per unit Per unit Per unit
ADC 2.5-V reference
Temperature sensor 85°C		 01A24h 2 Per unit Per unit Per unit Per unit
REF Calibration REF calibration tag 01A26h 1 12h 12h 12h 12h
REF calibration length 01A27h 1 06h 06h 06h 06h
REF 1.5-V reference factor 01A28h 2 Per unit Per unit Per unit Per unit
REF 2.0-V reference factor 01A2Ah 2 Per unit Per unit Per unit Per unit
REF 2.5-V reference factor 01A2Ch 2 Per unit Per unit Per unit Per unit
(1) NA = Not applicable, blank = unused and reads FFh.
Table 9-60 MSP430F5258, MSP430F5256, MSP430F5254, MSP430F5252 Device Descriptor Table
DESCRIPTION(1) ADDRESS SIZE (bytes) VALUE
F5258 F5256 F5254 F5252
Info Block Info length 01A00h 1 06h 06h 06h 06h
CRC length 01A01h 1 06h 06h 06h 06h
CRC value 01A02h 2 Per unit Per unit Per unit Per unit
Device ID 01A04h 1 00 02 04 06
Device ID 01A05h 1 82 82 82 82
Hardware revision 01A06h 1 Per unit Per unit Per unit Per unit
Firmware revision 01A07h 1 Per unit Per unit Per unit Per unit
Die Record Die record tag 01A08h 1 08h 08h 08h 08h
Die record length 01A09h 1 0Ah 0Ah 0Ah 0Ah
Lot/wafer ID 01A0Ah 4 Per unit Per unit Per unit Per unit
Die X position 01A0Eh 2 Per unit Per unit Per unit Per unit
Die Y position 01A10h 2 Per unit Per unit Per unit Per unit
Test results 01A12h 2 Per unit Per unit Per unit Per unit
ADC10 Calibration ADC10 calibration tag 01A14h 1 13h 13h 13h 13h
ADC10 calibration length 01A15h 1 10h 10h 10h 10h
ADC gain factor 01A16h 2 blank blank blank blank
ADC offset 01A18h 2 blank blank blank blank
ADC 1.5-V reference
Temperature sensor 30°C		 01A1Ah 2 blank blank blank blank
ADC 1.5-V reference
Temperature sensor 85°C		 01A1Ch 2 blank blank blank blank
ADC 2.0-V reference
Temperature sensor 30°C		 01A1Eh 2 blank blank blank blank
ADC 2.0-V reference
Temperature sensor 85°C		 01A20h 2 blank blank blank blank
ADC 2.5-V reference
Temperature sensor 30°C		 01A22h 2 blank blank blank blank
ADC 2.5-V reference
Temperature sensor 85°C		 01A24h 2 blank blank blank blank
REF Calibration REF calibration tag 01A26h 1 12h 12h 12h 12h
REF calibration length 01A27h 1 06h 06h 06h 06h
REF 1.5-V reference factor 01A28h 2 Per unit Per unit Per unit Per unit
REF 2.0-V reference factor 01A2Ah 2 Per unit Per unit Per unit Per unit
REF 2.5-V reference factor 01A2Ch 2 Per unit Per unit Per unit Per unit
(1) NA = Not applicable, blank = unused and reads FFh.