ZHCSD68H July   2014  – April 2021 LSF0204 , LSF0204D

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics: AC Performance (Translating Down, 3.3 V to 1.8 V)
    7. 7.7  Switching Characteristics: AC Performance (Translating Down, 3.3 V to 1.2 V)
    8. 7.8  Switching Characteristics: AC Performance (Translating Up, 1.8 V to 3.3 V)
    9. 7.9  Switching Characteristics: AC Performance (Translating Up, 1.2 V to 1.8 V)
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Load Circuit AC Waveform for Outputs
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Support High Speed Translation, Greater than 100 MHz
      2. 9.3.2 Bidirectional Voltage Translation Without DIR Terminal
      3. 9.3.3 5-V Tolerance on IO Port and 125°C Support
      4. 9.3.4 Channel Specific Translation
      5. 9.3.5 Ioff, Partial Power Down Mode
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 I2C PMBus, SMBus, GPIO, Application
        1. 10.2.1.1 Design Requirements
          1. 10.2.1.1.1 Enable, Disable, and Reference Voltage Guidelines
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Bidirectional Translation
            1. 10.2.1.2.1.1 Pull-Up Resistor Sizing
          2. 10.2.1.2.2 LS Family Bandwidth
        3. 10.2.1.3 Application Curve
      2. 10.2.2 MDIO Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Multiple Voltage Translation in Single Device, Application
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 接收文档更新通知
    2. 13.2 支持资源
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGY|14
  • YZP|12
  • RUT|12
  • PW|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision G (November 2019) to Revision H (April 2021)

  • 更新了整个文档的表、图和交叉参考的编号格式Go
  • Updated the Bidirectional Translation section to include inclusive terminologyGo

Changes from Revision F (January 2019) to Revision G (November 2019)

  • Changed Vref_A/B/EN max voltage to 5.5 V in the Recommended Operating Conditions tableGo

Changes from Revision E (December 2018) to Revision F (January 2019)

  • Changed location of YZP-package indicator dot to A3 position. Go
  • Added YZP package to Thermal Information tableGo

Changes from Revision D (December 2015) to Revision E (December 2018)

  • Changed location of YZP-package A1-pin indicator dot. View is looking through the device, as in an X-ray. Go

Changes from Revision C (August 2015) to Revision D (December 2015)

  • Added Type Column to Pin Functions tableGo
  • Added Junction Temperatures to Thermal Information tableGo

Changes from Revision B (April 2015) to Revision C (August 2015)

  • 删除了“特性”中的“低于最大传播延迟 1.5ns”项目符号Go
  • 更新了“特性”中的“支持 100MHz 以上的高速转换”项目符号Go

Changes from Revision A (December 2014) to Revision B (April 2015)

  • 向器件添加了 YZP 封装Go

Changes from Revision * (November 2014) to Revision A (December 2014)

  • 从首页“产品预发布”更改为完整数据表Go
  • 将 Section 3 中的文本从“传输速度大于 100Mbps”更改为“传输速度大于 100MHz”Go