ZHCSDB8A February   2014  – August 2014 LP8754

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  General Electrical Characteristics
    6. 6.6  6-Phase Buck Electrical Characteristics
    7. 6.7  6-Phase Buck System Characteristics
    8. 6.8  Protection Features Characteristics
    9. 6.9  I2C Serial Bus Timing Parameters
    10. 6.10 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Buck Information
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Descriptions
      1. 7.3.1 Multi-Phase DC-DC Converters
        1. 7.3.1.1 Multi-Phase Operation and Phase-Shedding
        2. 7.3.1.2 Transitions Between Low-Power PFM, PFM, and PWM Modes
        3. 7.3.1.3 Buck Converter Load Current
        4. 7.3.1.4 Spread Spectrum Mode
      2. 7.3.2 Power-Up and Output Voltage Sequencing
      3. 7.3.3 Device Reset Scenarios
      4. 7.3.4 Diagnosis and Protection Features
        1. 7.3.4.1 Warnings for Diagnosis (No Power Down)
          1. 7.3.4.1.1 Short-Circuit Protection (SCP)
          2. 7.3.4.1.2 Power Good Monitoring
          3. 7.3.4.1.3 Thermal Warnings
        2. 7.3.4.2 Faults (Fault State and Fast Power Down)
          1. 7.3.4.2.1 Undervoltage Lockout (UVLO)
          2. 7.3.4.2.2 Overvoltage Protection (OVP)
          3. 7.3.4.2.3 Thermal Shutdown (THSD)
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Auto-Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1  Register Descriptions
      2. 7.6.2  VSET_B0
      3. 7.6.3  FPWM
      4. 7.6.4  BUCK0_CTRL
      5. 7.6.5  BUCK1_CTRL
      6. 7.6.6  BUCK2_CTRL
      7. 7.6.7  BUCK3_CTRL
      8. 7.6.8  BUCK4_CTRL
      9. 7.6.9  BUCK5_CTRL
      10. 7.6.10 FLAGS_0
      11. 7.6.11 FLAGS_1
      12. 7.6.12 INT_MASK_0
      13. 7.6.13 GENERAL
      14. 7.6.14 RESET
      15. 7.6.15 DELAY_BUCK0
      16. 7.6.16 CHIP_ID
      17. 7.6.17 PFM_LEV_B0
      18. 7.6.18 PHASE_LEV_B0
      19. 7.6.19 SEL_I_LOAD
      20. 7.6.20 LOAD_CURR
      21. 7.6.21 INT_MASK_2
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Input Capacitor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 LDO Capacitor Selection
        5. 8.2.2.5 VIOSYS Capacitor Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 文档支持
      1. 11.2.1 相关文档 
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 机械封装和可订购信息

以下页中包括机械封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不对本文档进行修订的情况下发生改变。