ZHCSAS0L January   2005  – December 2014 LP38691 , LP38691-Q1 , LP38693 , LP38693-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 典型应用电路
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings: LP3869x
    3. 7.3 Handling Ratings: LP3869x-Q1
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Enable (EN)
      2. 8.3.2 Thermal Overload Protection (TSD)
      3. 8.3.3 Foldback Current Limiting
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable (EN)
      2. 8.4.2 Minimum Operating Input Voltage (VIN)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Reverse Voltage
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power Dissipation and Device Operation
        2. 9.2.2.2 External Capacitors
        3. 9.2.2.3 Input Capacitor
        4. 9.2.2.4 Output Capacitor
        5. 9.2.2.5 No-Load Stability
        6. 9.2.2.6 Capacitor Characteristics
        7. 9.2.2.7 RFI/EMI Susceptibility
        8. 9.2.2.8 Output Noise
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 WSON Mounting
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 相关链接
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings(1)(2)

MIN MAX UNIT
Lead Temp. (Soldering, 5 seconds) 260 °C
Power Dissipation(3) Internally Limited V
V(max) All pins (with respect to GND) –0.3 12 V
IOUT(5) Internally Limited V
Junction Temperature –40 150 °C

7.2 Handling Ratings: LP3869x

MIN MAX UNIT
Tstg Storage temperature range −65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –2 2 kV
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Handling Ratings: LP3869x-Q1

MIN MAX UNIT
Tstg Storage temperature range −65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –2 2 kV
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.4 Recommended Operating Conditions

MIN NOM MAX UNIT
VIN Supply Voltage 2.7 10 V
Operating Junction Temperature Range −40 125 °C

7.5 Thermal Information

THERMAL METRIC(1) LP38691 LP38693 LP3869x UNIT
TO-252 WSON SOT-223
3 PINS 6 PINS 5 PINS
RθJA(2) Junction-to-ambient thermal resistance 50.5 50.6 68.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 52.6 44.4 52.2
RθJB Junction-to-board thermal resistance 29.7 24.9 13.0
ψJT Junction-to-top characterization parameter 4.8 0.4 5.5
ψJB Junction-to-board characterization parameter 29.3 25.1 12.8
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.5 5.4 n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Junction-to-ambient thermal resistance, High-K.

7.6 Electrical Characteristics

Limits in standard typeface are for TJ = 25°C. Unless otherwise specified: VIN = VOUT + 1 V, CIN = COUT = 10 µF, ILOAD = 10 mA. Min/Max limits are specified through testing, statistical correlation, or design.
PARAMETER TEST CONDITIONS MIN TYP(4) MAX UNIT
VO Output Voltage Tolerance –2.0 2.0 %VOUT
100 µA < IL < 0.5 A
VO + 1 V ≤ VIN ≤ 10 V
Full operating temperature range		 –4.0 4.0
ΔVO/ΔVIN Output Voltage Line Regulation(6) VO + 0.5 V ≤ VIN ≤ 10 V
IL = 25 mA		 0.03 %/V
VO + 0.5 V ≤ VIN ≤ 10 V
IL = 25 mA
Full operating temperature range		 0.1
ΔVO/ΔIL Output Voltage Load Regulation(7) 1 mA < IL < 0.5 A
VIN = VO + 1 V		 1.8 %/A
1 mA < IL < 0.5 A
VIN = VO + 1 V
Full operating temperature range		 5
VIN - VOUT Dropout Voltage(8) (VO = 2.5 V) IL = 0.1 A 80 mV
IL = 0.5 A 430
(VO = 2.5 V)
Full operating temperature range		 IL = 0.1 A 145
IL = 0.5 A 725
(VO = 3.3 V) IL = 0.1 A 65
IL = 0.5 A 330
(VO = 3.3 V)
Full operating temperature range		 IL = 0.1 A 110
IL = 0.5 A 550
(VO = 5 V) IL = 0.1 A 45
IL = 0.5 A 250
(VO = 5 V)
Full operating temperature range		 IL = 0.1 A 100
IL = 0.5 A 450
IQ Quiescent Current VIN ≤ 10 V, IL =100 µA - 0.5 A 55 µA
VIN ≤ 10 V, IL =100 µA - 0.5 A
Full operating temperature range		 100
VEN ≤ 0.4 V, (LP38693 Only) 0.001 1
IL(MIN) Minimum Load Current VIN - VO ≤ 4 V
Full operating temperature range		 100
IFB Foldback Current Limit VIN - VO > 5 V 350 mA
VIN - VO < 4 V 850
PSRR Ripple Rejection VIN = VO + 2 V(DC), with 1 V(p-p) / 120 Hz Ripple 55 dB
TSD Thermal Shutdown Activation (Junction Temp) 160 °C
TSD (HYST) Thermal Shutdown Hysteresis (Junction Temp) 10
en Output Noise BW = 10 Hz to 10 kHz
VO = 3.3 V		 0.7 µV/√Hz
VO (LEAK) Output Leakage Current VO = VO(NOM) + 1 V at 10 VIN 0.5 12 µA
VEN Enable Voltage (LP38693 Only) Output = OFF
Full operating temperature range		 0.4 V
Output = ON, VIN = 4 V
Full operating temperature range		 1.8
Output = ON, VIN = 6 V
Full operating temperature range		 3.0
Output = ON, VIN = 10 V
Full operating temperature range		 4.0
IEN Enable Pin Leakage (LP38693 Only) VEN = 0 V or 10 V, VIN = 10 V –1 0.001 1 µA
(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a heatsink is used). When using the WSON package, refer to AN-1187 Leadless Leadframe Package (LLP), SNOA401, and the WSON Mounting section in this datasheet. If power dissipation causes the junction temperature to exceed specified limits, the device will go into thermal shutdown.
(4) Typical numbers represent the most likely parametric norm for 25°C operation.
(5) If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to ground.
(6) Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.
(7) Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from 1 mA to full load.
(8) Dropout voltage is defined as the minimum input to output differential required to maintain the output within 100 mV of nominal value.

7.7 Typical Characteristics

Unless otherwise specified: TJ = 25°C, CIN = COUT = 10 µF, Enable pin is tied to VIN (LP38693 only), VOUT = 1.8 V, VIN = VOUT 1 V, IL = 10 mA.
20126535.pngFigure 1. Noise vs Frequency
20126537.pngFigure 3. Noise vs Frequency
20126520.gifFigure 5. Ripple Rejection
20126524.gifFigure 7. Line Transient Response
20126528.pngFigure 9. Line Transient Response
20126544.png
Figure 11. Load Transient Response
20126531.pngFigure 13. VOUT vs Temperature (3.3 V)
20126533.pngFigure 15. VOUT vs Temperature (1.8 V)
20126560.pngFigure 17. VOUT vs VIN, Power-Up
20126553.pngFigure 19. Load Regulation vs Temperature
20126557.gifFigure 21. MIN VIN vs IOUT
20126536.pngFigure 2. Noise vs Frequency
20126518.gifFigure 4. Ripple Rejection
20126522.gifFigure 6. Ripple Rejection
20126526.pngFigure 8. Line Transient Response
20126542.pngFigure 10. Load Transient Response
20126530.pngFigure 12. VOUT vs Temperature (5.0 V)
20126532.pngFigure 14. VOUT vs Temperature (2.5 V)
20126559.pngFigure 16. VOUT vs VIN (1.8 V)
20126552.pngFigure 18. Enable Voltage vs Temperature
20126554.pngFigure 20. Line Regulation vs Temperature
20126556.gifFigure 22. Dropout Voltage vs IOUT