ZHCSAS0L January   2005  – December 2014 LP38691 , LP38691-Q1 , LP38693 , LP38693-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 典型应用电路
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings: LP3869x
    3. 7.3 Handling Ratings: LP3869x-Q1
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Enable (EN)
      2. 8.3.2 Thermal Overload Protection (TSD)
      3. 8.3.3 Foldback Current Limiting
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable (EN)
      2. 8.4.2 Minimum Operating Input Voltage (VIN)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Reverse Voltage
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power Dissipation and Device Operation
        2. 9.2.2.2 External Capacitors
        3. 9.2.2.3 Input Capacitor
        4. 9.2.2.4 Output Capacitor
        5. 9.2.2.5 No-Load Stability
        6. 9.2.2.6 Capacitor Characteristics
        7. 9.2.2.7 RFI/EMI Susceptibility
        8. 9.2.2.8 Output Noise
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 WSON Mounting
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 相关链接
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

NDP Package
3-Pin TO-252
Top View
20126503.gif
NDC Package
5-Pin SOT-223
Top View
20126504.gif
NC - No internal connection
NGG Package
6-Pin WSON With Exposed Thermal Pad
LP38691SD Top View
20126505.gif
NC - No internal connection
NGG Package
6-Pin WSON With Exposed Thermal Pad
LP38693SD Top View
20126506.gif

Pin Functions

PIN I/O DESCRIPTION
NAME TO-252 WSON SOT-223
IN 3 1, 6 1, 6 4 I This is the input supply voltage to the regulator. For WSON devices, both VIN pins must be tied together for full current operation (250mA maximum per pin).
GND TAB 2 2 5 — Circuit ground for the regulator. For the PFM and SOT-223 packages this is thermally connected to the die and functions as a heat sink when the soldered down to a large copper plane.
SNS — 5 5 — I WSON Only - Output sense pin allows remote sensing at the load which will eliminate the error in output voltage due to voltage drops caused by the resistance in the traces between the regulator and the load. This pin must be tied to VOUT.
EN — — 3 1 I The enable pin allows the part to be turned ON and OFF by pulling this pin high or low.
OUT 1 4 4 3 O Regulated output voltage
DAP — √ √ — — WSON Only - The DAP (Exposed Pad) functions as a thermal connection when soldered to a copper plane. See WSON Mounting section for more information.