SNVS361E July   2007  – November 2015 LP38513

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Short-Circuit Protection
      2. 7.3.2 Enable
      3. 7.3.3 ERROR Flag
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Operation
      2. 7.4.2 ERROR Flag Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
          1. 8.2.2.1.1 Input Capacitor
          2. 8.2.2.1.2 Output Capacitor
        2. 8.2.2.2 Reverse Voltage
        3. 8.2.2.3 Power Dissipation
        4. 8.2.2.4 Estimating Junction Temperature
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
IN pin voltage (survival) −0.3 6 V
EN pin voltage (survival) −0.3 6 V
OUT pin Voltage (survival) −0.3 6 V
ERROR pin voltage (survival) −0.3 6 V
IOUT (Survival) Internally limited
Power dissipation(3) Internally limited
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications.
(3) Device operation must be evaluated, and derated as needed, based on ambient temperature (TA), power dissipation (PD), maximum allowable operating junction temperature (TJ(MAX)), and package thermal resistance (RθJA).

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
Input supply voltage, VIN 2.25 5.5 V
Enable input voltage, VEN 0 5.5 V
ERROR pin voltage 0 VIN V
Output current (DC) 0 3 mA/A
Junction temperature(2) −40 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Device operation must be evaluated, and derated as needed, based on ambient temperature (TA), power dissipation (PD), maximum allowable operating junction temperature (TJ(MAX)), and package thermal resistance (RθJA).

6.4 Thermal Information

THERMAL METRIC(1) LP38513 UNIT
NDH (TO-220) KTT (DDPAK/TO-263)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 31.9 32.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43.7 37.6 °C/W
RθJB Junction-to-board thermal resistance 16.4 18.9 °C/W
ψJT Junction-to-top characterization parameter 8.3 5.7 °C/W
ψJB Junction-to-board characterization parameter 16.4 17.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.2 1.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Unless otherwise specified: VIN = 2.5 V, IOUT = 10 mA, CIN = 10 µF, COUT = 10 µF, VEN = 2 V, and limits apply for TJ = 25°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOUT Output voltage tolerance(1) 2.25 V ≤ VIN ≤ 5.5 V
10 mA ≤ IOUT ≤ 3 A		 –1.6% 0% 1.6%
2.25 V ≤ VIN ≤ 5.5 V
10 mA ≤ IOUT ≤ 3 A
TJ = –40°C to +125°C		 –4.1% 2.6%
2.25V ≤ VIN ≤ 5.5V
10 mA ≤ IOUT ≤ 3A
0°C ≤ TJ ≤ 125°C		 –2.6% 0% 2.6%
ΔVOUT/ΔVIN Output voltage line regulation(1)(2) 2.25 V ≤ VIN ≤ 5.5 V 0.03 %/V
2.25 V ≤ VIN ≤ 5.5 V
TJ = –40°C to +125°C		 0.06
ΔVOUT/ΔIOUT Output voltage load regulation(1)(3) 10 mA ≤ IOUT ≤ 3 A 0.1 %/A
10 mA ≤ IOUT ≤ 3 A
TJ = –40°C to +125°C		 0.2
VDO Dropout voltage(4) IOUT = 3 A, TJ = –40°C to +125°C 425 mV
IGND Ground pin current, output enabled IOUT = 10 mA, ERROR pin = GND 10 12 mA
IOUT = 10 mA, ERROR pin = GND
TJ = –40°C to +125°C		 15
IOUT = 3 A, ERROR pin = GND 12 15
IOUT = 3 A, ERROR pin = GND
TJ = –40°C to +125°C		 20
Ground pin current, output disabled VEN = 0.5 V, ERROR pin = GND 60 100 µA
VEN = 0.5 V, ERROR pin = GND
TJ = –40°C to +125°C		 110
ISC Short-circuit current VOUT = 0 V 5.6 A
ENABLE INPUT
VEN(TH) Enable on/off threshold VEN rising from 0 V until the output turns to an ON state, or VEN falling from ≥ 2 V until the output turns to an OFF state 0.74 0.85 0.92 V
VEN rising from 0 V until the output turns to an ON state, or VEN falling from ≥ 2 V until the output turns to an OFF state
TJ = –40°C to +125°C		 0.56 1
td(OFF) Turnoff delay Time from VEN < VEN(TH) to VOUT = OFF, ILOAD = 3 A 5 µs
td(ON) Turnon delay Time from VEN >VEN(TH) to VOUT = ON, ILOAD = 3 A 5
IEN EN pin current VEN = VIN 1 nA
VEN = 0 V –1
ERROR FLAG
VTH ERROR flag threshold(5) VOUT falling from VOUT(NOM) until ERROR flag goes low 85%
VOUT falling from VOUT(NOM) until ERROR flag goes low
TJ = –40°C to +125°C		 77% 94%
ΔVTH ERROR flag threshold hysteresis(5) VOUT rising from VTH until ERROR flag goes high 4%
VOUT rising from VTH until ERROR flag goes high
TJ = –40°C to +125°C		 2.2% 5.8%
VERROR(SAT) ERROR flag saturation voltage ISINK = 1 mA 20 mV
ISINK = 1 mA, TJ = –40°C to +125°C 100
Ilk ERROR flag pin leakage current VERROR = 5.5 V 100 nA
td ERROR flag delay time 1 µs
AC PARAMETERS
PSRR Ripple rejection VIN = 2.5 V, ƒ = 120 Hz 73 dB
VIN = 2.5 V, ƒ = 1 kHz 70
ρn(l/f) Output noise density ƒ = 120 Hz 0.8 µV/√Hz
en Output noise voltage BW = 100 Hz – 100 kHz, VOUT = 1.8 V 45 µVRMS
THERMAL CHARACTERISTICS
TSD Thermal shutdown TJ rising 165 °C
ΔTSD Thermal shutdown hysteresis TJ falling from TSD 10
(1) The line and load regulation specification contains only the typical number. However, the limits for line and load regulation are included in the output voltage tolerance specification.
(2) Output voltage line regulation is defined as the change in output voltage from the nominal value due to change in the voltage at the input.
(3) Output voltage load regulation is defined as the change in output voltage from the nominal value due to change in the load current at the output.
(4) Dropout voltage (VDO) is typically defined as the input to output voltage differential (VIN – VOUT) where the input voltage is low enough to cause the output voltage to drop 2% from the nominal value. For the LP38513, the minimum operating voltage of 2.25 V is the limiting factor, and the maximum dropout voltage is defined as: VDO(MAX) = VIN(MIN) – VOUT(MIN) = (2.25 V – (1.8 V × 95.9%) = 524 mV).
(5) The ERROR flag thresholds are specified as percentage of the nominal regulated output voltage. See Application and Implementation section.

6.6 Typical Characteristics

Unless otherwise specified: TJ = 25°C, VIN = 2.5V, VEN = 2 V, CIN = 10 µF, COUT = 10 µF, IOUT = 10 mA.
LP38513 20146811.png
Figure 1. VOUT vs Temperature
LP38513 20146812.png
Figure 3. Ground Pin Current (IGND) vs VIN
LP38513 20146814.png
Figure 5. Ground Pin Current (IGND) vs Temperature
LP38513 20146832.png
Figure 7. VOUT vs VEN
LP38513 20146818.png
Figure 9. ERROR Flag Low vs Temperature
LP38513 20146820.png
Figure 11. Load Regulation vs Temperature
LP38513 20146822.png
Figure 13. Current Limit vs Temperature
LP38513 20146831.png
Figure 15. Noise
LP38513 20146837.png
Figure 2. VOUT vs VIN
LP38513 20146813.png
Figure 4. Ground Pin Current (IGND) vs Temperature
LP38513 20146816.png
Figure 6. Enable Threshold vs Temperature
LP38513 20146817.png
Figure 8. VOUT ERROR Flag Threshold vs Temperature
LP38513 20146819.png
Figure 10. ERROR Flag Leakage vs Temperature
LP38513 20146821.png
Figure 12. Line Regulation vs Temperature
LP38513 20146829.png
Figure 14. PSRR